Thin film stress and flatness tool

09/01/1998

Thin film stress and flatness tool

The FSM128LC2C is a fully automated film stress and flatness tool that handles 300-mm wafers. It comes in an open cassette version or a fully FOUP integrated system, and up to two buffers are available. The system features auto wafer thickness measurements, auto dual laser switching, and autocalibration. Throughput is >70 wafers/hr. Among the options are wafer thickness profiling, including total thickness variations and product wafer measurements. Frontier Semiconductor Measurements, San Jose, CA; ph 408/452-8898, fax 408/452-8688, www.frontiersemi.com.