Readers flip for flip chip Readers flip for flip chip

09/01/1998

Readers flip for flip chip

I subscribe to Solid State Technology. I am mostly interested in flip-chip package technology and am working in that area. I carefully read Pete Burggraaf`s article "Chip scale and flip chip: Attractive solutions" (July, p. 239), which gave me a lot of information. Could you give me more information on polymer flip-chip technology, such as a reference or company that might supply these materials?

Chang-Myung Ryu

Research Assistant, EE Dept.

Arizona State University

Richard Estes and Frank Kulesza at Epoxy Technology are the principal developers of the polymer flip-chip technology discussed in the article. Both are industry veterans, and very knowledgeable and widely published on the applications of polymers for packaging and assembly in semiconductor manufacturing. You can contact them at Polymer Flip Chip Corp., P.O. Box 929, Billerica, MA 01865; ph 978/667-0071, fax 978/667-4446, [email protected]. -P.B.

I found the flip-chip article in the July issue to be very informative. Although Pete Burggraaf covered many of the new solutions for CSP and FC-DCA packaging in his article, there was an omission of which your readers should be aware. DuPont has developed a new, low-cost, fine-pitch bumping technology called Tacky Dots. Tacky Dots is a proprietary system that incorporates a film of photoimageable adhesive coated on Kapton. The protoype process is running in our facility in Research Triangle Park, NC, which is making samples for customers. Any inquiries should be sent to [email protected], or ph 919/248-5032.

Brian Quinn

New Business Initiative Manager

DuPont