Automatic UV curing system

08/01/1998

Automatic UV curing system

The UH201 automatic UV curing system provides a highly controlled environment to assure uniform UV exposure of wafers up to 200 mm. The UV adhesion process gives easier post-saw die removal than with conventional films, increased pick and place yield over higher adhesive films, and low stress removal of the film from ultrathin or fragile wafers. Features of the system include: cassette-to-cassette loading and unloading; N2 purge for complete adhesive curing; a serpentine-style, ozone-free grid lamp for consistent UV exposure; a microprocessor-based, programmable controller; and a touch-screen control panel. Ultron Systems Inc., Moorpark, CA; ph 805/529-1485, fax 805/523-1061, e-mail [email protected].