KGD test/ handling

08/01/1998

KGD test/handling

The MP650 combines automatic bare die handling with multiple levels of vision inspection and up to five test stations, for sequential, parallel, or combined testing. It accepts standard frame-mounted wafers or individual die in waffle pack trays with output to tape, waffle pack trays, bulk bins, or reconstructed wafer with 100% known good die (KGD). The die are selected automatically via vision (ink dot rejection) or by wafer mapping and then rotated into position and placed in a flipper nest. This can flip the die 180? for inspection or testing of the bottom side of the die, and the die is then inserted into a test nest where it is contacted by conventional wafer probes. Throughput is 2200 units/hour. Ismeca USA Inc., Carlsbad, CA; ph 760/931-1153, fax 760/931-8713, e-mail [email protected].