Issue



Europe


08/01/1998







Europe

Chip Supply Inc., Orlando, FL, has acquired the die assessment business of Rood Technology UK Ltd. (RTUK). Chip Supply will take over the RTUK die sales

office and personnel, and will use RTUK`s assembly and test capacity to support die business in Europe.

F&K Delvotec, Ottobrunn, Germany, has shipped the first of several model 6400 rotary head wire bonders to Hewlett Packard, Colorado Springs, CO, which will manufacture complex multichip modules. In addition, F&K received an order for 10 automatic die and wire bonders from RF Monolithics Inc., Dallas, TX. RF will use the units to produce surface acoustic wave filters.

Gindre Copper LLC, a French extruder of copper and copper alloys for the electrical and electronics industries, is entering the North American market by establishing headquarters in Laurence Harbor, NJ. The company`s line of products will be sold directly to OEMs and through selected distributors. Gindre`s capacity is 100 million pounds of copper and alloy products/year.