Microlithography cluster

06/01/1998

Microlithography cluster

The Polaris 2500 microlithography cluster has been designed for the needs of 0.18-?m photoresist processing. The thermal process stations are packaged in six bake/chill and prime/chill pairs, vertically stacked in a single module. This increases the capacity of the central handling system, so that a single robot can support >90 wafers/hr for DUV processing. System throughput can be increased to

150 wafers/hr by adding another handler, as in the Polaris 2200. Critical-dimension control is improved through enhancements of the 2500`s Dynamic Dispense process, and coat uniformity, bake temperature uniformity, and environmental control all show advances over previous models. Coupled with advanced scheduling algorithms, the cluster meets the rigorous timing requirements of 193- and 248-nm DUV processing. Polaris 2500 is extendable to 300-mm with no increase in footprint. FSI International Inc., Chaska, MN; ph 612/448-8043, fax 612/361-8478, www.fsi-intl.com.