300-mm foup

06/01/1998

300-mm FOUP

The SMIF-Pod 300 front opening unified pod (FOUP), a reliable and cost-effective wafer carrier solution for 300-mm wafer fabs, meets the needs of =0.18-?m devices and offers good seal performance, process control, washability, and cost of ownership. Its static dissipative feature eliminates electrostatic discharge events in the pods. Additional pod features include ultralow outgassing and a patented pod latch system that optimizes locking security without particulate generation. Integrated SEMI-compatible gas purging features allow easy incorporation of the gas purge option. SMIF-Pod 300 also offers a choice of carrier auto identification options, including the infrared-based SMART-Tag, barcode, or radio frequency. Asyst Technologies Inc., Fremont, CA; ph 510/661-5000, fax 510/661-5166.