Post-etch polymer and residue removal

06/01/1998

Post-etch polymer and residue removal

These noncorrosive photoresist strippers/polymer removers are formulated for sub-0.5-?m IC processes incorporating high-density plasma etch. The PRx-400 removers dissolve hard-to-remove inorganic polymers from DPS, TCP, and ECR etchers 2-3? faster than conventional strippers. They operate at significantly lower temperatures (30-50?C) and offer very good process latitude. In addition to standard plasma etch for aluminum interconnects, these formulations are highly effective in copper and low-k dielectric dual-damascene processes. The PRx-400 series removers are water-soluble, biodegradable, and contain no SARA Title III reportables, and they do not attack soft metals such as copper, aluminum, titanium, and tungsten. The series meets the requirements of next-generation products with 0.18-?m design rules. Silicon Valley Chemlabs Inc., Santa Ana, CA; ph 408/732-4700, fax 408/732-0733.