News Update

06/01/1998

Wafer dicing system

Designed to process III-V material, thin silicon, sapphire, glass, and ceramics, the LSD-100 integrated scribe-and-break (100 mm) wafer dicing system has a throughput of approximately 120,000 uniformly high-quality dice/hr (0.010 ? 0.014 in. GaAs FET die). The tool provides high yields because it scribes in one direction and breaks in the other for each cycle, instead of scribing and then breaking the en-tire wafer. Continuous process monitoring by precision optics and sensors verifies scribing and breaking as it happens. Loomis, St. Helena, CA; ph 707/963-4111, fax 707/963-3753.