Die Bonder

06/01/1998

Die bonder

Model 4500 is a multichip epoxy die bonder that features dispensing and stamping capability, multiple stamping, pick-and-place and eject tools, die input from frames, rings, waffle or Gel-Packs, 8-in. wafer handling, standard indexing systems for film, substrates, boats, and leadframes, a Cognex pattern recognition unit, linear motor drive systems, and UNIX-based real-time operating software. F&K Delvotec Bondtechnik GmbH, Ottobrunn, Germany; ph 49/89-62995120, fax 49/89-62995101.