Flip chip placement

06/01/1998

Flip chip placement

The Micron SC is a high-performance flip chip placement tool that is based on frictionless air bearings and ceramic x-y beams supported on a granite base, allowing 10-?m placement accuracy at 3s. It performs up to 2000 uph; footprint is 1 m2. The SC is designed to focus on single- and few-chip packages for flip chip with inherent capabilities for high-accuracy die attach to handle various substrates (from leadframes to J boats) and to pick from a variety of semiconductor feeders. ESEC, Phoenix, AZ; ph 602/893-6990, fax 602/893-6793.