Bumped Wafer Characterization

06/01/1998

Bumped wafer characterization

The WS-1000 is a bumped wafer characterization system that offers throughput up to 15 wafers/hr with 1-?m measurement repeatability. User-defined SPC charting allows real-time monitoring of bumping process parameters, thereby closing the process-control feedback loop. The system can handle 100- to 200-mm wafers for inspection of pre-reflow and post-reflow solder bumps and multiprocess gold bumps. RVSI Electronics, Hauppauge, NY; ph 516/273-9700, fax 516/273-1167.