Load-locked etching system

06/01/1998

Load-locked etching system

The RIE-200 iP load-locked etching system uses the latest inductively coupled plasma technology to perform high-speed, 0.25-?m etching of the thin films used in ULSI processing. The system allows the precise anisotropic etching of silicon, metals, and compound semiconductor materials. The Tornado Coil Electrode is the key to the efficient and stable generation of high-density plasma, permitting the high-selective etching of up to 0.25-?m patterns. Low bias (below -100 V) eliminates plasma-related damage to devices, and temperature control of the reactor walls and the sample stage allows for stable process parameters. The system is chlorine gas compatible. Samco International Inc., Kyoto, Japan; ph 408/734-0459, fax 408/734-0961.