Gold wafer bumping

06/01/1998

Gold wafer bumping

A service featuring automation and efficient manufacturing processes, located in Hsinchu Science-based Industrial Park, offers gold wafer bumping to LCD display driver, COG, and TBGA users. The company has integrated its office area and manufacturing floor using a proprietary MRP system, which includes on-line wafer status tracking and centralized process recipe control. Its Class 100 and Class 1000 fab occupies 22,000 ft2, and processes 6000 wafers/month (up to 150 mm). A second cleanroom fab scheduled to be on-line this year will support an additional 30,000 wafers/month and will supply solder bumping service and 200-mm wafer capabilities. Chipbond Technology Corp., Hsinchu, Taiwan; ph 886/3-567-8788, fax 886/3-567-8789, e-mail [email protected]