Imaging Tool

05/01/1998

Imaging tool

The new SEM-based XL850 defect review and inspection tool is engineered specifically for evaluation, yield management and failure analysis applications supporting design rules to 0.18 microns and beyond. Featuring dual cassette robotics for Class 1 cleanrooms, it provides instant in-line access to critical semiconductor process information. The XL850 offers low voltage operation, with 3 nm resolution from 1 to 30 kV. An electron column provides balanced-field, in-lens detection of both back-scattered and secondary electrons to provide exceptional topographical detail, down hole visibility and enhanced grain boundary imaging. The XL850 also incorporates predictive software control and a Windows GUI, including a multi-dimensional matrix with more than a dozen variables. Additionally, the tool features integrated EDX analysis, which provides spatial resolution down to 0.3 microns with optimized geometry for light elements and high count rates. It is the latest cleanroom-compatible addition to this company`s XL800 family of advanced defect review, analysis and characterization tools. FEI Co., Hillsboro, OR; ph 503/640-7500.