Flip chip bonder

05/01/1998

Flip chip bonder

Model CB-5w semiautomated flip chip bonder is a granite-based tool designed to perform high-accuracy, low-force flip chip bonding (5 g to 2 kg) in both prototype and pre-production modes. The system handles chips as small as 20 ?m in size and can place various die from different types of die carriers onto substrates up to 10 ? 10 in. The system incorporates user-friendly pictorial software; it consists of this company`s patented optical probe, with high-resolution for precise alignment and bonding (?1 ?m). Forces, temperature profiles, and timing parameters used for bonding are fully programmable. The tool uses an innovative planarization system that is suitable to work off nonreflective surfaces. Machine flexibility allows local reflow by resistive IR or pulsed heat, as well as top and bottom UV curing and adhesive dispensing. Research Devices Inc., Piscataway, NJ; ph 732/572-4800 ext 114, fax 732/572-4808.