F-HDP/PECVD process

05/01/1998

F-HDP/PECVD process

This high-volume production implementation of a CVD low-k fluorinated high-density plasma (F-HDP) film for 0.25-?m logic devices is offered for use on the existing customer base of SPEED HDP systems. The integration sequence combines an F-HDP gapfill process with an in situ PECVD capping layer, reducing cost of ownership by as much as 50%. A typical 2-?m IMD stack using F-HDP and PECVD can be deposited in the integrated SPEED system at throughputs of >30 wafers/hour. Novellus Systems Inc., San Jose, CA; ph 408/943-9700, fax 408/943-3422, www.novellus.com.