Wafer inspection after dicing

05/01/1998

Wafer inspection after dicing

The KIS2000 inspects wafers after dicing to monitor the dicing machines using statistical process control (SPC). The tool automatically scans the front and back sides of the wafer and monitors kerf (cut) chipping sizes, kerf width, misalignment, and kerf offset, as well as chipping proximity to the die edge. Chipping is automatically differentiated from other shapes, making the kerf inspection accurate and reliable. A powerful SPC package provides wafer maps and charts for visualization of results, and shows trends for every measured parameter for a given dicing machine, period of time, product, and lot. Inspectech Ltd., Carmiel, Israel; ph 972/4-9885242, fax 972/4-9888781, e-mail [email protected].