Asia/Pacific

05/01/1998

Asia/Pacific

Taiwan Semiconductor Manufacturing Co. is reportedly scheduled to break ground on its first 300-mm wafer fab in 2Q98, following in line with plans the company announced last year to build a manufacturing center in the Tainan Science-based Industrial Park. The 300-mm fab will cost more than $2 billion, according to reports by Taiwan`s Central News Agency. The company has already begun construction on its sixth wafer fab; its fourth and fifth fabs came online last year.

Kulicke & Soffa Industries Inc. (K&S), Willow Grove, PA, has received a $1 million order from Cypress Semiconductor Philippines Inc. for model 8020 gold ball bonders for its production facility in Cavite City, Javalera, Philippines. K&S has also received a $6 million order from Integrated Device Technology Inc. (IDT), for 25 model 8060 wedge bonders and 12 model 8020 ball bonders for IDT semiconductor assembly and test facilities in Penang, Malaysia, and Manila, Philippines. In Manila, K&S and Amkor/Anam Pilipinas Inc. plan to implement a fully automated semiconductor assembly line at Amkor`s P3 factory. K&S`s subsidiary American Fine Wire has opened a new R&D facility in Ang Mo Kio, Singapore.