etch/planarization seminar

04/01/1998

Etch/planarization seminar

This training class is part of a series of courses on advanced wafer processing developed by Integrated Circuit Engineering (ICE) for new and experienced technicians and engineers. Topics to be covered include technology trends; etching chemistries; isotropic vs. anisotropic etch; applications for various etch techniques; the glow discharge process; control of the plasma process; measurement techniques; equipment considerations; process characterization techniques; and SPC applications. The seminar will be held on July 8 and 9, in Denver, CO, and on October 21 and 22, in Framingham, MA. Price: $650. ICE, Scottsdale, AZ; ph 602/515-4260, fax 602/515-9781, e-mail [email protected], www.ice-corp.com.