Plasma chip carrier cleaner

04/01/1998

Plasma chip carrier cleaner

n this chip carrier cleaning process, the carriers stay in the magazines for cleaning. Just one cleaning step is required after die bonding because the plasma process has a long-term effect. After cleaning, cost-saving handling of the carriers in air is usual. In addition to higher yield in wire bonding and molding, the system offers several advantages: no sputtering and redeposition; no electronic damage to sensitive chips; no damage to plastic chip carrier material and polyimide; and automatic etch stop at metals (only contamination is removed). Two versions are available: LFC 100 is an in-line system for easy integration into automated packaging lines; and LFC 150 is a manual system for up to eight magazines/batch. Throughput is typically 1000 strips/hr. Balzers Instruments, Balzers, Liechtenstein; ph 75/388-4673, fax 75/388-5411.