Endpoint control for CMP tools

04/01/1998

Endpoint control for CMP tools

OPTIMA 9300 is designed for real-time, in situ, nonintrusive, layer-independent endpoint control for oxide, STI, and metal semiconductor layers for CMP tools. It incorporates dynamic signal process techniques to compensate for drift and noisy signal conditions, and it can capture data from nonintrusive current sensors that are easily mounted. The 9300 can be integrated easily with current CMP tools and can detect endpoint on eight polishing heads. It includes a user-friendly touchscreen, Windows-based software interface, and an Ethernet connection, allowing for off-line analysis and reprocessing. Luxtron Corp., Santa Clara, CA; ph 408/727-1600, fax 408/727-1677, e-mail [email protected].