Wafer cleaning systems

04/01/1998

Wafer cleaning systems

Omega2000 and Omega4000 advanced wafer cleaning, rinsing, and drying systems are designed to process very large substrates, including 200- and 300-mm wafers and FPDs, while providing particle reduction at geometries =0.25 ?m. The 2000 reduces metal contamination and surface roughness, and eliminates water staining and water spots through use of the CleanPOINT water-cleaning system, which uses electrostatically charged filters to provide ultrapure DI water and remove microscopic particles. The two-tank Omega4000 can be used for the critical pre-gate oxide, pre-metal, and post-CMP cleaning processes. It can feature two 200-mm chambers or a single/dual 300-mm chamber, with no degradation to the process. YieldUP International Corp., Mountain View, CA; ph 650/964-0100, fax 650/940-4388.