LETI and Leica develop lithography process

03/01/1998

LETI and Leica developlithography process

The LETI/GRESSI R&D lab in Grenoble, France, is working in conjunction with Leica Lithography Systems to develop a hybrid lithography technique that will combine the speed of a DUV stepper with the resolution of an e-beam writing tool on the same device level. The partners have signed a two-year joint agreement for the development, which will focus on resolving overlay issues between the two exposure tools. The smallest features of the device (below 0.18 micron) will be written using the e-beam tool, while an ASML DUV stepper will handle the larger features. So instead of hours to write the complete device using e-beam, only minutes will be needed using both e-beam and DUV optical at the die level. A LETI spokesman described the process as coat resist/e-beam expose/DUV expose/develop resist. So far, the project has seen investment of around $8 million. Leica has contributed its VB6-HR e-beam tool, and other equipment used in the project includes a JMG prototype overlay metrology tool, a Veeco AFM, and an Opal CD-SEM.