Literature Update

03/01/1998

NEWS

Daewoo Electronics, Seoul, South Korea, and

SGS-THOMSON Microelectronics, Paris, France, have agreed to establish a joint design center company in Seoul. The center will be used to develop ICs for existing consumer electronics applications and future products for digital and high definition TV, digital VCR and DVD, telecommunications, computers, and other products. The center will be initially staffed by 20 people, and when fully operational, will have 60 design engineers. The design center company will be equally owned by Daewoo and SGS-THOMSON, and the position of president of the joint venture will alternate between the two companies. Daewoo executive director Chan Hyoung Kang will be the first president.

Equipe Technologies Inc., Sunnyvale, CA, will install its dual-arm atmospheric robot for 300-mm wafer handling at a major Japanese semiconductor manufacturer. Equipe will service and support the installation from its office in Iwakura City, Japan. Equipe maintains a second office in Yokohama, Kanagawa Prefecture.

Eaton Semiconductor Equipment Operations will begin construction of a $75.6 million minifab and a $13 million expansion of its manufacturing facility at its headquarters in Beverly, MA. Eaton also opened a new $2.8 million process lab at its Fusion Systems Division in Rockville, MD. The projects are part of Eaton`s $91.5 million facilities investment strategy.

Mallinckrodt Bakers, Phillipsburg, NJ, will build a $30 million microelectronic chemicals plant in Temple, TX, near Austin. The plant will supply ultrapure cleaning and etching chemicals to Samsung Austin Semiconductor LLC`s DRAM device fab in Austin.

Sumitomo Metal Industries is planning to merge operations with its wafer-making subsidiary, Sumitomo Sitix, and will fund a new 50 billion yen ($377 million) plant in Imari, Saga Prefecture, Kyushu Island. Industry observers in Japan have noted that the merger will give Sumitomo Metal a better position in the electronics business. First year funding of the new large-diameter wafer manufacturing facility will be 10 billion yen. Sumitomo Sitix has already purchased 45,800 m2 of land adjacent to its existing plant in Imari for the project.

DuPont Photomasks Inc. (DPI), Round Rock, TX, and United Microelectronics Corp. (UMC) have signed a memorandum of understanding to establish a joint venture to produce photomasks. To be named DuPont Photomasks Taiwan Ltd., the venture will manage and expand UMC`s existing photomask production operations at its wafer foundries in Hsinchu, Taiwan. UMC will contribute cash and photomask manufacturing assets; DPI will contribute cash, technology, and expertise in commercial photomask production.

ESC, Ivyland, PA, and ANORAD, Hauppauge, NY, have entered a joint development agreement covering both technology and sales cooperation for the newly introduced models 5300 and 5400 flip chip bonders. ANORAD will add its high-speed linear motion control with ESC`s die bonder manufacturing to produce high-speed automatic flip chip die bonding systems with placement accuracy of ?12 ?m at 3 s. ESC will provide sales, marketing, and service in Asia and the US.

Plasma-Therm Inc., St. Petersburg, FL, is participating in the 9" Reticle Equipment Task Force, sponsored by SEMI. Comprising a number of top semiconductor manufacturers, the task force defines standards and the technical roadmap for 9" reticle-making equipment. Plasma-Therm is the only participating dry etch manufacturer.

Taiwan Semiconductor Manufacturing Co. (TSMC) will continue its aggressive capital spending in coming years, but expects its equipment suppliers to make improvements in lead time, quality, and most importantly tool cost. Rick Tsai, TSMC`s executive VP for operations, said that TSMC does not expect to see a major impact from the current Asian financial crisis because its customer base is centered in the US and Europe.

ATMI Inc., Danbury, CT, has formed the Emosyn Division, a fabless venture that will initially target devices for the fast-growing smart card market. Emosyn builds on ferroelectric materials and process integration technology, which ATMI developed in a three-year consortium with IBM, Texas Instruments, and Micron Technology.

ENI, Rochester, NY, has signed a contract to provide its entire range of plasma power sources and instrumentation to a leading global manufacturer of semiconductor equipment for the next three years. The contract is valued at $85 million.

AIO Corp., Fremont, CA, a maker of wafer tracks and cleaning products, has named Atwell Technical Services to represent its track products in Texas from offices in Austin and Breckenridge. Group T Microelectronics Manufacturing and Test will represent AIO`s cleaning products in Arizona and New Mexico. Semiconnect in Munich will represent AIO`s cleaning products in Germany.

Marvell Semiconductor has chosen Tyecin Systems Inc.`s TS/X planner for its supply chain management solution. Los Altos, CA-based Tyecin supplies planning and scheduling applications to the microelectronics industry. The TS/X will link Marvell`s offshore foundries for manufacturing, inventory, and customer delivery.

National awards

Solectron Corp., Milpitas, CA, a provider of customized electronics manufacturing services, won the 1997 Malcolm Baldrige National Quality Award. Having also won the award in 1991, Solectron is the first company to win the award twice in the 10-year history of the program. Solectron has 18 manufacturing facilities worldwide, more than 20,000 employees, $3.7 billion in revenue, and a 5.8% market share. Solectron has also celebrated its 20th year in business, and presented its Crystal Award for consistent on-time delivery, quality, long-term support, and dedication to 26 suppliers.

The Institute for Interconnecting and Packaging Electronic Circuits (IPC), Northbrook, IL, has received the Communicator Awards Crystal Award for Excellence for its training video Overview of Component Preparation. IPC also received an Honorable Mention Award for Through-Hole Rework, which was produced in cooperation with Pace Inc.

In addition, the IPC presented its Special Recognition Award to Marta Minadeo of Trace Laboratories for her work on creating and developing test methods for coating materials.

EMCORE Corp., Somerset, NJ, has received the US Small Business Administration`s Tibbetts Award. Named for Roland Tibbetts of the Small Business Innovative Research (SBIR) program, the award recognizes SBIR technological innovation, economic impact, and business achievements. EMCORE`s researchers were honored for their III-Nitride-based wide bandgap materials and device development, and gallium indium arsenide-based materials and devices. EMCORE also received the Product Development Company of the Year award from the New Jersey Technology Council.

Industry awards

Fujitsu Ltd. and NEC Corp., both of Kawasaki, Japan, received the 1997 Display of the Year Award for excellence in an electronic information display for their development and initial commercialization of the 42-in. color plasma display panel. The award was presented by the Society for Information Display and Information Display magazine. Honorable Mention went to Sony Corp., Tokyo, Japan, for the FD Trinitron CRT picture tube with an entirely flat face.

Harris Semiconductor`s Advanced Technology Power Division in Kuala Lumpur, Malaysia, received the 1997 Award for Total Productive Maintenance Excellence, presented by Japan`s Institute of Plant Maintenance. The award recognized Harris` achievements in plant operations. Harris` division is the first Malaysian firm to receive the award.

Mattson Technology Inc., Fremont, CA, ranked seventh in the Silicon Valley Technology Fast 50. Mattson, which experienced a 6560% growth in revenue from 1992 to 1996, was the only semiconductor equipment manufacturer to be listed in the top 20.

Franco Cerrina and Henry Smith received the first Robert W. Hill Memorial Award for contributions to the advancement of x-ray lithography, presented at the "X-Ray Lithography Business Summit" hosted by Suss Advanced Lithography Inc., Waterbury Center, VT. Cerrina is professor of electrical and computer engineering at the University of Wisconsin. Smith holds the Joseph F. and Nancy P. Keithly chair in electrical engineering at MIT.

Company and supplier awards

Novellus Systems Inc., San Jose, CA, a maker of wafer fabrication systems for thin-film deposition, received the Supplier of the Year award from Philips Semiconductors in recognition of its global system performance and support.

Kyocera America Inc., San Diego, CA, a supplier of ceramic IC packaging, has been named Vendor of the Year by Integrated Device Technology Inc., Santa Clara, CA. Kyocera received the Pinnacle Award for its quality, technology, and on-time delivery.

Johnson Matthey Electronics, Spokane, WA, has received the 1997 Preferred Supplier Award from Hewlett-Packard Co. for its technology, quality, responsiveness, delivery, cost, and concern for the environment.

Credence Systems Corp., Fremont, CA, a maker of automatic test equipment, received the Cirrus Logic Supplier Excellence Award for product development, support, and leadership.

Matheson Gas Products, Montgomeryville, PA, was named Atlanta Works Elite Supplier by Lucent Technologies, Norcross, GA. The award recognized excellence in product quality, on-time delivery, customer service, and partnership fulfillment. Matheson has won the award three times in four years.

Lepco Inc., Houston, TX, received a special award from Amkor/Anam, Makuli City, The Philippines, for outstanding completion of Amkor`s new Plant 3 facility and cleanroom, and for the smooth transfer of Amkor`s assembly and test operations.

Regional awards

MEGA Systems & Chemicals Inc., Chandler, AZ, a maker of chemical blending and distribution systems, was named to the AzTech 50 for 1997 and recognized as the second fastest growing high-tech company in Arizona.

RF Micro Devices, Greensboro, NC, a maker of radiofrequency ICs, ranked number 1 in the North Carolina Technology 50 list of fastest-growing technology companies in the state. RF Micro Devices exceeded 11,000% growth over the past five years.

Trebor International, West Jordan, UT, was recognized as the 84th fastest growing company in Utah for 1997. Trebor, which designs and manufactures high purity fluid handling products for the semiconductor industry, achieved greater than a 200% growth rate over the past four years.

Comdisco Electronics Group, San Jose, CA, a firm that helps reduce technology cost and risk for companies that acquire and manage electronic manufacturing, testing, and assembly equipment, has received the Service Providers of the Year Award, to Silicon Valley. The award is presented by Coopers & Lybrand L.L.P., Venture Law Group, and Silicon Valley Bank.

Sonix Inc., Springfield, VA, received the 1997 FastTrack Award, which recognizes the fastest growing companies in the Washington, DC, metropolitan area. Sonix, which manufactures test and inspection equipment, achieved the triple- or quadruple-digit growth required of the winners.

Achievements

Asyst Technologies Inc., Fremont, CA, a supplier of minienvironment and SMIF-based technology, has shipped its 100,000th Asyst-Pod and 50,000th SMART-Tag. The units were shipped to National Semiconductor Inc.`s new facility in South Portland, ME.

Lam Research Corp., Fremont, CA, a supplier of semiconductor and flat panel display equipment, has shipped its 500th TCP 9400SE high-density polysilicon, polycide, and shallow trench isolation etch system. The unit was shipped to Siemens Microelectronics Center GmbH in Dresden, Germany.

OnTrak Systems Inc., San Jose, CA, a provider of capital equipment for CMP, has shipped its 500th cleaning system.

SAES Pure Gas Inc., San Luis Obispo, CA, a member of the SAES Getters Group headquartered in Milan, Italy, has shipped its 500th MegaTorr gas purifier.

FSI International Inc., Minneapolis, MN, has shipped its 300th EXCALIBUR vapor cleaning system to TECH Semiconductor in Singapore. The system will be used for post-RIE cleaning applications.

GaSonics International, San Jose, CA, has shipped its 100th performance enhancement platform system to a leading semiconductor manufacturer in Taiwan. The system will be used for advanced photoresist removal on sub 0.35-?m logic and memory devices.

NEW PRODUCTS

Sample preparation

The Techprep8 calibrated polishing machine has touch-pad controls, keypad entry, and a strong motor; the Multi-prep micro positioning head features a precision spindle design, micrometer controls, and a digital dial indicator that displays the sample removal rate in 1-?m increments. Together, the two instruments offer precision IC die cross-sectioning; wedge polishing for TEM analysis; parallel lapping/deprocessing; backside grinding for LSM analysis; and prem FIB/TEM thinning. Allied High Tech Products Inc., Rancho Dominguez, CA; ph 310/635-2466, fax 310/762-6808.

Laser scanning confocal microscope

Using proprietary scanning technology to provide high-performance 3-D surface inspection, KovexVision examines materials without mechanically touching or probing the surface. Reflected laser light is collected from the focal point of a laser beam as it intersects with a sample surface. As the beam scans, a PC correlates reflections from the surface of the sample with the known position of the beam. The computer monitor then displays the data as a 3-D image. Specialized software allows this image to be viewed from any angle, rotated, and measured. KovexVision displays the 3-D sample image with all image points in focus simultaneously, allowing for precise point-to-point measurements in every dimension. Kovex Corp., Shoreview, MN; ph 612/486-9830, www. kovexcorp .com.

Gate oxide integrity test

This new technique, Bounded Step Current, overcomes the limitations of traditional means of measuring gate oxide integrity. It is available in ProCap v 6.3 software for the SSM 5200 yield enhancement tool. By measuring the IV characteristic of test structures with a current ramp, premature failure mechanisms are avoided. Since these test structures can be built into production wafer scribe lines, the method has no negative impact on fab production capacity, and it identifies gate oxide quality problems with a high level of certainty. Solid State Measurements Inc., Pittsburgh, PA; ph 412/787-0620, e-mail [email protected].

FPD surface analysis system

The VCA-4100 flat panel display (FPD) surface analysis system accepts panels up to 650 ? 550 mm in size, providing critical information on FPD surface characteristics. The panel is placed onto a large x-y stage, which is moved into the desired position. A droplet is then dispensed under computer control for precise sizing and released onto the substrate. The high-magnification lens and fiber-optic light source allow the droplet to be profiled; Windows 95 application software then automatically calculates the contact angle. Data and images can be stored and printed for future reference and analysis. AST Products Inc., Billerica, MA; ph 978/667-4500, e-mail [email protected].

Pulsed power generation

PowerMOD solid-state, high-voltage pulse modulators are designed for semiconductor and materials processing, offering very high reliability. They are composed of standardized solid-state switch modules that allow complete adjustability of process parameters and a broader operating range. PowerMOD model HVPM 20-2000 generates up to 40 MW of power in a single pulse 1000 times/sec, and handles over 2000 amps in current; other models provide pulses up to 120 kV in voltage. Diversified Technologies Inc., Bedford, MA; ph 781/275-9444, fax 781/275-6081, www.divtecs.com.

Combined bake/fill module for LCDs

The latest in the MELP (modular equipment for LCD production) series of combo modules, BKFI-110/160, combines both a vacuum bake chamber and an LC filling chamber into one module. It allows empty cells to be heated under vacuum without exposing the sensitive LC material to excessive heat. Process time is greatly reduced via concurrent vacuum stages and lowered port LC viscosities. The dual chamber also eliminates the possibility of cell recontamination, because the cells do not need to be transferred from a separate oven to a filling chamber. Hornell Automation Inc., Twinsburg, OH; ph 330/405-1419, fax 330/405-1420, e-mail info@hornell. com, www.hornell.com.

Ozone monitor

Model 450 ozone monitor has measuring ranges from 0-1 ppm to 0-1000 ppm and a lower detectable limit of 0.003 ppm. It is well suited to area monitoring for OSHA safety requirements (0.1 ppm for continuous exposure and 0.3 ppm for short-term exposure). The instrument is available in single-channel, three-channel, and six-channel configurations for sampling one or more locations. It has an internal sample pump, and analog and digital outputs with concentration alarms. Advanced Pollution Instrumentation Inc., San Diego, CA; ph 800/324-5190, fax 619/657-9816.

High-pressure gas probe

Model HPGP high-pressure gas probe monitors contaminants at line pressure, operating at pressures from 40 to 150 psig. Sizing sensitivity is available at 0.1 ?m with a flow rate of 0.1 SCFM. The probe is contained in a cylindrical pressure vessel that serves as a safety containment housing, and during operation the contaminant vessel is pressurized with dry nitrogen. If the pressure vessel leaks to ambient or if there is an internal gas leak into the vessel, power is disabled. The metal inlet fitting surfaces are electropolished stainless steel, providing compatibility with many nontoxic gases and aerosols. Particle Measuring Systems Inc., Boulder, CO; ph 303/443-7100, fax 303/449-6870.

Wafer cutting tool

The Silicon Router laser system is designed for the nonlinear cutting of silicon wafers; it cuts arcs, circles, inside cut outs, rectangles, or any complex pattern. The cutting kerf width can be as low as 50 ?m, with cutting speeds of 5 mm/sec. The laser system includes an optical viewing system with CCTV monitor, as well as optional wafer cassette auto loading/unloading. Resonetics Inc., Nashua, NH; ph 603/886-6772, fax 603/886-3655, e-mail resnetic.com, www.resonetics.com.

Tip evaluation system

Available for all NanoScope Dimension and MultiMode scanning probe/atomic force microscopes, this tip evaluation system determines whether the tip meets a selected sharpness criterion or should be replaced. The package includes the proprietary tip evaluation software, as well as a roughness standard that is scanned as part of the evaluation. Based on the analysis, the software presents a worst-case tip sharpness in numerical and graphical form, including displaying an image of the tip itself. Digital Instruments, Santa Barbara, CA; ph 805/967-1400, fax 805/967-7717, e-mail [email protected].

Large-sample SPM

The VISTA-100 is a scanning probe microscope (SPM) whose innovative mechanical design and integration of the SPM controller into the computer chassis produces a very small footprint. It is designed to accept samples up to 6 ? 6 ? 1 in. (150 ? 150 ? 25 mm) onto the manual x-y stage. The translator and support block can easily be removed without the use of tools, allowing the instrument to accommodate samples up to 11 in. (280 mm) in width and 4 in. (100 mm) in height. Other design features include the use of gradient index lens technology to provide a view of the sample area and to focus the laser spot on the cantilever probe. Burleigh Instruments Inc., Fishers, NY; ph 716/924-9355, fax 716/924-9072, e-mail [email protected], www.burleigh.com.

CAD navigation software

Merlin`s Framework Version 6.0, for IC CAD navigation applications in failure analysis and design, has interface and navigation capabilities for more than 40 types of equipment. It is fully Sun Solaris and OS compatible and has additional capabilities, such as a text-based search for easy location of any given signal address, image pan for faster visual navigation throughout the layout, and image overlay for a more thorough analysis of the association between the image displayed on a review tool and its corresponding layout image. Knights Technology Inc., Sunnyvale, CA; ph 408/988-0600, www.knights.com.

300-mm wafer shipper

Voyager is a 300-mm wafer shipper that features a 13-wafer capacity. Each reuseable shipper includes secondary packaging and has a kinematic coupling for equipment interface. The shipper body is made of transparent polycarbonate material, the covers from PBT material blend. Voyager weighs 7.1 lbs with wafers and 3.3 lbs without. Fluoroware Inc., Chaska, MN; ph 612/448-8193, fax 612/368-4078, www.fluoroware.com.

High-temperature probe holders

Model 79-H probe holder, for applications where the holders must be above a high-temperature chuck while maintaining low electrical leakage characteristics, has been tested in applications up to 400?C. It is available with coaxial or triaxial characteristics, with either the set screw or pinjack method of holding the probe tip. At 500 VDC, the electrical isolation characteristics of the 79-H are >5 Tera ohms with <40 fa leakage, with a >10 Tera ohm and <10 fa leakage model available. Micromanipulator Co. Inc., Carson City, NV; ph 800/967-2426, www.micromanipulator.com