Spin etchers

03/01/1998

Spin etchers

The "Spin Etcher Front Master" is used for versatile frontside applications such as post-CMP cleaning, oxide removal/thinning, structuring (oxide, silicon, aluminum), polysilicon etch, polymer removal, and wafer reclaim. The "Spin Etcher for 300-mm Processing" is a wet processing tool for the next generation of wafers, which has undergone a marathon test at I300I. Both machines offer flexibility in various processes (back- and frontside applications, back- and frontside mixed-mode used for wafer reclaim), and several handling and installation options. They can be equipped with industry-standard interface options (e.g., AGV, OHT, etc.). Typical backside applications include the removal of thin oxide films, nitride polysilicon, copper, and other metals, as well as silicon substrate etch for stress relief/damage removal and wafer thinning with rough or polished finish etch. Sez AG, Villach,Austria;ph 43/4242-204, fax 43/4242-20421.