Double-head diebonder

03/01/1998

Double-head diebonder

The PPS 2300 series double-head diebonder is customized for such applications as leadframe, MCM, and BGA. Each module is equipped with two bonding heads, either with a dispensing, stamping, or pick-and-place tool. This is also valid for a two-module machine. A possible equipment configuration, therefore, is: epoxy - pick-and-place - epoxy - pick-and-place. With a working range of 3 ? 3 in., the tool is multichip-compatible and has high throughput (up to 8000 parts/hour with a two-module machine). Parts from the wafer (up to 8 in.), tapefeeder, waffle pack, and GEL PAK (2/4 in.) can be placed with an accuracy of <25 ?m. Datacon, Radfeld, Austria; ph 43/5337-64834, fax 43/5337-648349, e-mail [email protected].