Backside thinning system

03/01/1998

Backside thinning system

Chip UnZip, the system that thins backside silicon in flip chips and other face-down designs to permit emission imaging of defects, has been enhanced so that the speed with which the die is thinned has increased by more than 100%. The system removes epoxy or ceramic packaging and backside silicon in a window precisely defined to give access to the active area of the die, while leaving the leads intact. When the thinned chip is biased, defects emit light through the thinned silicon. Hypervision Inc., Fremont, CA; ph 510/651-7768, fax 510/651-1415,

e-mail [email protected].