Surface modification and cleaning

03/01/1998

Surface modification and cleaning

This 18-in. aluminum chamber plasma cleaning system eliminates wet chemicals in cleaning processes, is CFC-free, and produces no harmful effluent. It can be used in surface modification to increase bonding strength between parts. The system is designed with off-the-shelf components except for a heavy wall, aluminum chamber. Mass flow control is standard. Modules and subassemblies can be added to standard platforms. Automated or manual systems and companion 14- and 24-in. systems are available. Anatech Ltd., Springfield, VA; ph 703/941-8860 or 800/PLASMA9, fax 703/941-8077