Failure analysis/debug

03/01/1998

Failure analysis/debug

Laser microchemical processing systems achieve high-speed (>100,000 ?m3/sec) etching of probe trenches through hundreds of ?m of backside, flip-chip silicon ICs, and rapid deposition of narrow (<1-30 ?m wide), high-purity platinum interconnect lines. The etching process volatizes silicon into silicon chloride at the focus of a scanned CW argon laser beam; etching is precisely endpointed using the laser`s optical beam induced current in the IC. High-conductivity lines are deposited at hundreds of ?m/sec. Revise Inc., Burlington, MA; ph 617/272-9888, fax 617/221-1482, [email protected].