Sputtering system

03/01/1998

Sputtering system

The SSC-1000 sputtering system incorporates upper and lower base plates for sputter up or sputter down operation. It is a multistation, moving substrate system, configurable with up to four adjustable DC or RF round cathode stations, which can be used for sequential or co-deposition processing. Features include a single-plane, multisubstrate rotating fixture and a rotating shutter for predeposition processing and positive thickness cutoff control. The system can be configured for substrate heating, as well as sputter etch and ion beam pre-etch/clean. CHA Industries Inc., Fremont, CA; ph 510/683-8554, fax 510/683-3848, e-mail [email protected], www.chaindustries.com.