Automated ball attach systems

02/01/1998

Automated ball attach system

The VAi 6000 fully automated BGA ball attach work cell performs the entire ball cycle in 20 sec through a ball transfer process that accomplishes simultaneous ball placement on all substrates located within its work envelope. To do this, it uses a screen print process for fluxing and a gravity feed technique for ball placement. The system can process a wide variety of single and strip BGA substrate formats. Through the use of an interchangeable input handling system, single devices in trays or boats, as well as strip substrates containing multiple devices in magazines, can be processed using one ball attach system. The 6000 can also process chip scale BGA (0.3-mm ball size), connector, and ceramic BGA devices. Vanguard Automation Inc., Tucson, AZ; ph 520/297-2621, fax 520/544-0535.