Low k dielectric material

02/01/1998

Low k dielectric material

FLARE 2.0, with k = 2.8, combines low k dielectric constant, thermal stability, low moisture absorption, and high glass transition temperature. When exposed to temperatures from 385-450?C, it exhibits no increase in dielectric constant. In addition, a high glass transition temperature of >400?C provides a larger processing window, while thermal stability to 425-450?C results in stable film. The high glass transition temperature and very low outgassing characteristics of FLARE 2.0 are optimized for compatibility with current BEOL processing temperatures. AlliedSignal Inc., Los Gatos, CA; ph 408/341-3055, fax 408/341-3001, e-mail [email protected].