Issue



PBGA adhesive


02/01/1998







PBGA adhesive

Ablebond 8510 fast-cure, die-attach adhesive is designed for PBGA packaging. Cure times are reduced to 15 min at 150?C, and cycle times are further reduced since this material does not require drying of the PBGA substrates prior to die attach. 8510 exhibits very good moisture resistance, allowing packages to achieve higher levels of JEDEC moisture performance. Ablestick Electronic Materials and Adhesives, Rancho Dominguez, CA; ph 310/764-4600, fax 310/764-2545.