Conductive polymer

02/01/1998

Conductive polymer

Unlike solder, EPO-TEK E2101 silver-filled epoxy does not flow when subjected to heat. Designed for stencil printing, it exhibits a smooth, thixotropic consistency for reliable and reproducible fine pitch print. Developed specifically for the PFC process for conductive bumps in flip chip assembly, this two- component epoxy is 100% solids and contains no solvent or thinner that will "dry out" during processing. It exhibits a volume resistivity of 0.0001 to 0.0004 ohm-cm, low outgassing, Al:Al lap shear of 1500 psi, and thermal conductivity of 2.1 W/m?K. Epoxy Technology Inc., Billerica, MA; ph 978/667-3805 or 800/227-2201, fax 978/663-9782.