Flip chip underfill

02/01/1998

Flip chip underfill

Chipshield 2527 is a UV and/or heat cure, low-coefficient-of-expansion flip chip underfill that has very low viscosity and high flow for capillary chip underfills, while maintaining a very low coefficent of thermal expansion - <30 ppm/?C. The epoxy around the perimeter can be surface cured with UV light in a few seconds to fixture the underfill. The epoxy under the chip, shielded from the UV, is then cured in a short heat post cure. Electronic Materials Inc., Breckenridge, CO; ph 970/547-0807, fax 970/547-0817, e-mail [email protected].