Metrology tool for 300 mm

02/01/1998

Metrology tool for 300 mm

The MetaPULSE 300 nondestructive, metal-film metrology system uses picosecond ultrasonic laser sonar technology to measure on product wafers. Capable of measuring film thickness in multilayer stacks, the system fills the critical requirements of multilayer metal applications involving CVD, liners, low-k dielectrics, and Cu. With ? accuracy and sub-? repeatability, the tool measures individual layers on product stacks composed of six or more layers, ranging from <20? to >5 ?m. In addition to thickness, the tool measures interfacial effects -interlayer reactions, contamination, oxidation, and poor adhesion. Since it measures completed wafer stacks, MetaPULSE can detect misprocessing results such as missing layers. The system also determines RMS roughness, as well as material density and phase. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, fax 973/691-5480, www.rudolphtech.com.