Process Furnaces

01/01/1998

Process furnaces

Series 6000 furnaces are designed for such processes as diffusion, oxidation, annealing, and LPCVD, on wafers up to 300 mm. Features include operational temperatures to 1300?C; closed tube processing for high-purity and reproducible environments; moving furnace elements for fast heat-up and cool-down; cantilevered (noncontact) automatic loading; cascade temperature control using external (furnace) and internal (process) thermocouples for real-time, in-situ control of temperature profile; better than 0.5?C flat zones up to 48 in. long; independent computer control of each process tube; 1-4 stack systems with right- or left-hand loading; automatic gas controls for dry oxidation, pyrogenic oxidation, liquid source doping, and gaseous source doping; and LPCVD of polysilicon, silicon dioxide, and silicon nitride. CVD Equipment Corp., Ronkonkoma, NY; ph 516/981-7081, fax 516/981-7095, e-mail [email protected], www.cvdequipment.com.