Semiconductor components

01/01/1998

Semiconductor components

EPI Teflon semiconductor components (for use in such equipment as valve plugs, aspirator nozzles, wafer carriers, and tanks) are molded and machined from PTFE and PTFM to customer specifications in sizes ranging from 0.5- to 60-in dia. ? 8-in. thickness. Unaffected by photoresists, acids, and corrosives, they can be cleaned with DI water, and their low coefficient of friction virtually eliminates particle shedding. Chemically inert, impervious to moisture, and free of microvoids and microporosity, the components can operate at -450 to +500?F. Engineering Plastics Inc., Westboro, MA; ph 508/366-4425, fax 508/366-2575, e-mail [email protected].