Wafer cleaning system

01/01/1998

Wafer cleaning system

Model UH 117 wafer cleaning system removes debris from sawing operations. It can clean wafers of diameters up to 150-mm, mounted on film frames. Fully programmable automatic microprocessor control and a completely encased washing, rinsing, and drying chamber eliminate all operator and external variables. Drying is accomplished using the system`s programmer to control a choice of hot or cold nitrogen (or air), blown through an air knife onto the wafer. Ultron Systems Inc., Moorpark, CA; ph 805/529-1485, fax 805/523-1061.