Product News
12/01/1999
Low-k spin clusters
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The ACS 200/LK and ACS 8/LK microlithography clusters feature enabling technology for low-k dielectric spin coating: solvent-rich, super-low-turbulence coating chambers that maximize planarization and minimize chemical consumption during coating; low-oxygen curing ovens and specialized vacuum bake chambers; and special Windows NT software that allows programmable, automatic bowl and nozzle cleaning and complex process flows. The systems also offer this company's "Auto-sizing" capability, which permits programmable software control and configuration of the clusters for Semi specification 100, 125, 150, and 200mm wafers and 4, 5, and 6-in. squares. Karl Suss, Munich, Germany; ph 49/89-320-07129; in US, ph 802/244-5181, www.suss.com.
Automated stocker and delivery system
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This Class 1 certified system automatically stores, transports, and retrieves work in process. The Automated Storage and Retrieval Unit — a hermetically sealed unit that offers very good control of humidity, contamination, temperature, and UV, while ensuring tight inventory and management control — is interfaced with the Shuttleworth vertical conveyor to produce a system that automatically stores components such as pods containing wafers during work in process, transports these components to various processing tools, and retrives them as programmed. An exact inventory of the components is automatically maintained, including processes done, processes to be done, and product location. The vertical conveyor interfaces with a horizontal transport conveyor mounted on the ceiling to maximize cleanroom space, moving components through contaminated areas or to another cleanroom for further processing. The static dissipative and conductive plastics used on the conveyor minimize ESD build-up and eliminate particle shedding. Completing the system is FANUC Robotics' LR Mate 100i robot, which automatically loads and unloads pods to and from the automated storage unit and conveyor. Terra Universal Inc., Anaheim, CA; ph 888/777-3363, fax 714/992-2179, www.terrauni.com.
System-on-a-chip test
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With data rates up to 400 Mbits/sec, overall timing accuracy of ±350 ps, and integrated high-performance analog instrumentation, the HP 93000 SOC Series Model 400 production test system provides the level of performance, accuracy, and reliability required by manufacturers of system-on-a-chip (SOC) test applications. Standard configurations offer up to 960 digital pins, plus four analog instruments; the system supports a maximum of 32 analog instruments. All the systems in the 93000 SOC Series use this company's Gigabit Technology Test processor-per-pin architecture for maximum flexibility and independent parallel testing, leading to very high throughput levels. A very low noise floor — a key enabler for testing most advanced SOC devices — is also common to all members of the 93000 family. The C400 gives flexibility and minimum risk for the cost-driven SOC test market, along with continuity for existing HP 83000 VLSI test-system users. The system addresses the need for testing PC133 devices today and will meet future development requirements such as PC200/PC266 or RDRAM. Hewlett-Packard Co., Palo Alto, CA; ph 800/452-4844 ext 6721, www.hp.com.
Large panel singulation
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The LPS-350 is a large panel system that accomplishes singulation via a dual supported gang blade, offering very high UPH (12,000+ on some devices), thereby delivering maximum flexibility to cut a wide variety of substrates with low cost of ownership. Substrates can be up to 350mm square. The system is well suited to BGAs, PCBs, copper panels, discrete components, ceramics (fired/unfired), silicon, or gallium arsenide. Abrasive blade or carbide cutting/slicing/dicing saws are used for maximum performance. Blade sizes and types include 50 to 150mm diamond, CBN, and solid carbide with gang quality blades for multi-wheel, high-UPH singulation. A Windows-based user interface provides unlimited CNC control power while MTIvision NT II, this company's fully integrated vision system, provides for automatic alignment and inspection of parts. The LPS-350 is available for production in manual, semi-automatic, and fully automatic versions. Manufacturing Technology Inc., Ventura, CA; ph 805/644-9681, fax 805/644-3541.
Process Equipment
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Slurry delivery pump
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The Champion SL20 is an air-operated, completely nonmetallic slurry delivery pump that is designed for use in CMP applications. It significantly reduces shear effects, which can cause slurry agglomeration, and it gives the smooth, consistent flow that is critical for slurry delivery. This is accomplished using a shaftless, smooth flow path with oversized orifices, along with near-pulseless overlapping discharge cycles produced by this company's Cross Phase Discharge control. The SL20 also features very high suction lift, a PTFE/PFA flow path, up to 6 gpm flow rate, and nonmetallic construction without elastomer O-rings. Trebor International, West Jordan, UT; ph 801/561-0303, fax 801/255-2312, www.treborintl.com.
Packaging/Assembly/Test
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Parallel seam sealers
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The Model 2300 family of parallel seam sealers can handle packages down to 1mm square. With resolution and repeatability down to 0.0002 in., they can routinely seal 2mm packages and are ready for the 1mm generation. The parallel seam sealing process works at lower temperatures and with less heat penetration into the part than the traditional furnace-based glass frit seal technique. Automation features allow the 2300 to seal up to 1000 packages/hour. Model 2300 PSS is a manually loaded parallel seam sealer that permits weld or solder sealing in linear or rotary mode, with maximum reliability and precision. With the 2300 PSS/DLL, digital lid loading automates the lid placement process, with placement driven by a fully digitized, dual vision system on both the package and the lid. Model 2300 Cassette Automation allows users to benefit from the efficiency of batch automation by loading complete trays or cassettes of packages for sealing. Model 2300 Full Automation incorporates both digital lid loading and cassette automation for high-productivity, high-yield sealing. Solid State Equipment Corp., Villanova, PA; ph 215/328-0700, fax 215/328-9410.
Ag conductive epoxy dispenser
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The MRSI-175 Ag precision dispense system has two heads that can be configured with one stamp head, with the ability to repeatedly stamp dots as small as 0.005 in. The system utilizes a micrometer-adjustable wiper blade and a rotating well to ensure that a consistent volume of epoxy is transferred to the stamping tool. MRSI, Chelmsford, MA; ph 978/256-4950, fax 978/256-5120, email [email protected].
Die sorter
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The DS-4000 SpeedStar die sorter gives high speed and versatility within a small footprint and at low cost. It features motorized collets and synchronized die eject to pick and place die sizes from 0.008 to 1.000 in. sq, at speeds up to 3500 die/hr. It offers fully automatic sorting with manual loads and unloads and handles wafers up to 8 in. It outputs to waffle packs, GEL-PAKs, JEDEC trays, film frames, custom carriers, and tape and reel. The system features wafer rotation, stretch and alignment, an intelligent vision system, ink dot recognition, and wafer mapping. Laurier Inc., Londonderry, NH; ph 603/626-4700, fax 603/626-4242.
Hardware/Accessories
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Nanopositioning stage
The NPS-Z-15L stage offers >15µm of closed loop travel, with sub-nm resolution and stability and pure axial motion to <5µrad motion. It is designed for high stiffness, allowing loads up to 5 kg to be carried. Optimized mechanical design has yielded a device with an unloaded resonant frequency of >8000 Hz. Super Invar construction gives the stage very high thermal and environmental stability. Dynamic optimization via closed loop PID electronics maximize the in situ stepping response and position stability of the system. Electronic configurations can offer independent control of up to 3 or 6 stages, ideal for alignment/leveling of large optic or wafer/mask devices. Queensgate Instruments Inc., East Meadow, NY; ph 516/357-3900, fax 516/357-9686.
Elevator retrofit kit
This new elevator kit reduces maintenance and particles, and improves reliability in any type of screw-drive lift mechanism. The kit, which can be installed in about 4 hrs, fits directly in place of the original elevator components in systems such as IPA vapor dryers. To reduce wafer vibration and the resulting particles, the kit isolates the motor from the lift rails. By replacing plastic components with stainless steel, using higher-tolerance materials, and improving the integrity of moving components, the kit maintains alignment longer and offers longer life. J&S Technical Assoc. Inc., Florham Park, NJ; ph 973/443-0516, fax 973/443-0528, www.jstechnical.com.
Laser mask marking
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The Allmark APS laser mask marking system has microprocessor control of all relevant system functions, including self-diagnosis, thermally stable laser resonator, and Power Switch — an all solid-state module for operating the high-voltage discharge of the laser. Power Switch is an alternative to classical thyratrons and eliminates the problems of conventional solid-state modules. It has no switch-induced self-firing and is maintenance-free over its lifetime of >1 billion pulses/marks. Maximum marking speeds are up to 90,000 products/hr; maximum line speeds are 50m/sec. The APS has a lower gas consumption than conventional mask CO2 lasers, a single 50-liter gas bottle being sufficient for 365 days/3 shift operation over at least two years. Alltec-Foba, Lubeck, Germany; ph 49/451-3909-391, fax 49/451-3909-399, e-mail [email protected], www.alltec.org.
Modular cooling system
The Modular Cooling System (MCS) line consists of eight models with cooling capabilities from 500-11,500W. An efficient copper or stainless steel heat exchanger assembly, pump, and reservoir maintain the coolant temperature within a few degrees of the air or water cooling it. Standard features of the MCS include an easy-to-read reservoir level indicator, a top-mounted port for easy access to the fluid reservoir, a rugged, all-welded steel frame for good durability, and heavy-duty vibration-isolation mounting feet. Lytron Inc., Woburn, MA; ph 781/933-7300, fax 781/935-4529, e-mail [email protected], www.lytron.com.
Vacuum Equipment
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Vacuum-compatible stages
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The PL Series precision direct drive positioning stages have x/y travel to >300mm and rotation >360° and offer vacuum compatibility to 10-7 torr. Direct drive motion and in-position stability to better than 20nm are provided by this company's Piezo Electric Linear Motors. Also available is a wedge z axis with travel of 12mm. Closed loop feedback is accomplished via direct readout linear encoders with servo control provided by the company or by customer-supplied controls. Anorad Corp., Hauppauge, NY; ph 516/231-1995, fax 516/435-1612, e-mail [email protected], www.anorad.com.
Vacuum packaging system
The VPS-100 is designed specifically for wafer packaging and is Class 100 cleanroom compatible. A stainless steel table provides an ergonomic work surface. The system is easy to use, with hands-free sealing. The VPS-100 handles 100-200mm cassette boxes; its table height is 37 in.; seal bar height is 41.7 in.; overall height is 45 in.; width is 28.5 in.; and depth is 30.5 in.; Automation Technology Inc., Salem, OR; ph 503/390-2336, fax 503/390-2353, www.automationtechnology.com.
Dry roughing pump
The ACP 20 is a dry roughing pump designed to meet the increasingly stringent demands of the semiconductor industry for cleanliness and low cost of ownership. Its 5-stage multiroots design provides high reliability, and low pressure bearing replacement after two years can be carried out easily by the end-user. There is no oil back-streaming in this leaktight system, and no particle backstreaming because there are no wearing parts that can generate particles in the path of pumped gases. Alcatel Vacuum Technology, Annecy, France; ph 33/0450-65-7777, fax 33/0450-7789, www.alcatel.com.
Contamination Control
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Wet scrubber technology
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The Cloud Chamber Scrubber (CCS) is a wet scrubber technology that allows particulate and water droplets to be charged with an opposite polarity using only 500W of power. In the CCS, billions of droplets and particles move continuously in relation to each other. As they approach 10µm of separation, electrical attraction causes the particulate to enter the droplets — collector water droplets are delivered to the particulate in a new way. Advantages of the system include the requirement of <1 in. of pressure drop under full load operation. The CCS is applicable to both soluble and insoluble particulate, and can remove fumes and gases simultaneously with particulate. The CCS has demonstrated >99% efficiency for the collection of all types of particulate from 0.1 to 3.0µm. Tri-Mer Corp., Owosso, MI; ph 517/723-7838, www.tri-mer.com.
Pellicle removal system
This automated pellicle removal system eliminates the risk of damage to expensive reticles and reduces the time spent during cleaning. The Pellicle Removal Station automatically removes pellicles of all shapes and sizes (up to 9 in. sq.) precisely and repeatedly, while leaving the membrane intact. Its technology drastically reduces risk of reticle contamination and damage, replacing the traditional way of removing pellicles by hand. ISM Technology Inc., Nashua, NH; ph 978/649-9350, fax 603/598-3758, www.ismtek.com.
Wafers/Wafer Handling
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Edge-gripping end-effectors
TALON-II pressure-driven, edge-gripping end-effectors are supplied in configurations for 4, 6, 8, and 12-in. wafers. The TALON-II-FS is designed as a fail-safe end-effector that is 100% compliant with Semi specifications for non-intrusive, edge-gripping wafer handling; it has fast operating speeds, positive holding, and no backside contamination. It operates on 15-60 psi of dry nitrogen, allowing operation in both atmosphere and vacuum chambers. The fail-safe feature is standard on the TALON-II-FS and will retain the wafer being transported in case of any catastrophic system failure. EEI End-Effectors Inc., Santa Clara, CA; ph 408/727-0100.
Wafer for advanced processes
The 200mm fLASH! wafer can be used in advanced microelectronics applications such as logic and DRAM. It consists of a refined surface layer on top of a cost-efficient, precipitation-optimized substrate, leading to high gate-oxide integrity and high gettering efficiency. With this layer-on-top system, surface refinement and crystal-growing processes can be optimized independently of one another. The resulting wafers have superior properties for deep-submicron applications: low burn-in failure rates due to high gate-oxide integrity; low leakage currents due to increased lifetimes; and high gettering efficiency due to strong precipitation in the wafer bulk. Wacker Siltronic AG, Burghausen, Germany; ph 49/86-7783-1961, fax 49/86-7783-3083, e-mail [email protected], www.wacker-siltronic.de.
Software
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Systems integrator
The Silverbox system integrator for semiconductor production automation can be easily integrated into the MES/CIM architecture of manufacturing units and includes a software package embedded in a universal connection platform. The package is compatible with Windows NT and Sematech CIM framework. The platform is in a compact enclosure fitted with all needed connectors. Software Industries, Montpelier, Cedex, France; ph 33/467-0337-00; fax 33/467-0337-20, www.software-industries.com.
Waferless pattern recognition
This Waferless Pattern Recognition software, developed for this company's FOCUS SL, SpectraLaser, S200/300 and MetaPulse transparent and opaque thin-film metrology product lines, uses coordinate information, which can be electronically transferred from the lithography system and a stored pattern image, eliminating the need to load an actual wave. Recipes can take only 2-5 min to create instead of the typical 10-30 min using a sample wafer. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, fax 973/691-5480, www. rudolphtech.com.
Gas Handling
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Surface mount gas delivery
The Cube surface mount gas delivery system is made of 316L stainless steel and has built-in secondary containment for use with hazardous and toxic materials like in CVD processes. The product's modular design aids in the installation of gas systems and offers quick and easy access to specific problem areas. With rapid disassembly, a contaminated area can be taken apart and completely cleaned, re-electropolished and refitted without taking the whole assembly apart. Syncro Vac, Milpitas, CA; ph 408/945-6333, www.syncrovac.com.
Robotics/Automation
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Glass substrate transfer robots
The AdeptAtlas robots are designed for FPD transfer and LCD transfer applications. The two models, 720S and 720D, handle large-scale substrates up to 600 x 720mm. They are atmospheric three-axis (single-arm) and four-axis (dual-arm) robots that give total flexibility of movement within the work envelope and are Class 10 cleanroom compatible. They use highly reliable, maintenance-free AC servomotors, are easy to operate using dedicated command sequences, and are SECS/GEM compatible. The robots also feature substrate checking sensors, ensuring that the substrate is correctly positioned on the end effectors. Adept Technology Inc., San Jose, CA; ph 408/434-5021, fax 408/545-5794, www. adept.com.
Materials
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Low-resistivity components
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Low Resistivity Grade CVD Silicon Carbide components are designed for wafer-handling equipment that requires RF coupling. The highly pure material is a solid ceramic that can be fabricated into components up to 700 x 700 x 20mm, and custom tubes and liners. Highly suitable for RTP/epi rings and susceptors, as well as plasma etch chamber components, the material is ideal where high temperatures (>1500°C), ultrahigh purity (>99.9995%), and chemical resistance are system requirements. CVD Silicon Carbide contains no secondary phase at grain boundaries, resulting in components with lower particle generation. Morton Advanced Materials, Woburn, MA; ph 800/552-2283, fax 781/933-5142, www.mortoncvd.com.
Metrology
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DUV spectrophotometer
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The CAMS-507 DUV automated spectrophotometer provides precise reflectance, absorption and transmission measurements in the 120nm to >350nm wavelength range. It is designed to measure samples including CAF2, dry fused silica, deep UV optics, thin-film coatings, photoresists, and silicon wafers under vacuum or purged conditions. The product is available with an option for measuring samples at 157or 193nm under polarized conditions. Acton Research Corp., Division of Roper Scientific, Acton, MA; ph 978/263-3584; fax 978/263-5086, www.acton-research.com.
Compact process monitoring system
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The Orion compact process monitoring system has a closed ion source quadrupole mass spectrometer and integrated turbomolecular pump for in situ monitoring during PVD. The Vacuum System Controller for the integrated differential pumping system and the Compact Orion Controller are combined into a single on-board unit, which simplifies installation, provides higher reliability, and minimizes space requirements. Three mass ranges are offered: 1-100amu, 1-200amu, and 1-300amu. The compact Orion PVD system can directly monitor at process pressures up to 3 mTorr with ppb-range sensitivity. MKS Instruments Inc., Andover, MA; ph 800/227-8766, 978/975-2350; fax 978/975-0093, www.mksinst.com.
Video microscope
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The PS-1000 video microscope monitors the side view of solder balls beneath BGA, CSP, or QFP. This model is designed for easy on-screen inspection of external solder balls of re-worked BGA and CSP, which is an alternative to an x-ray device. Through the probe, a special prism, you can see the 0.5mm pitch on the monitor with a CCD camera, and also can print out or make a report using a PC. V.S. Technology Corp., Tokyo, Japan; ph 81/35413-4847, fax 81/35413-4867, email [email protected].