Product News
11/01/1999
Dielectric etch system
 |
The Dielectric Etch Super e Centura, which addresses dielectric applications that include advanced metal vias, contact etch, mask open, pad, and spacer etch, represents an advance on this company's dielectric etch MERIE (magnetically enhanced reactive ion etch) systems. It features a new high-power RF system for higher etch rates and enhanced wafer handling, resulting in throughputs up to 110 wafers/hour. Critical dimension uniformity, which is vital for consistent device performance, has been substantially enhanced by a new ceramic electrostatic chuck, achieving <±10nm bias variation for 0.18µm devices. The Super e chamber is available on the Centura and Etch Centura II platforms, and upgrades are available for the installed base of Dielectric Etch MxP+ chambers. Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, www.appliedmaterials.com.
Multichip bonder
 |
Model 2200 apm is a multichip bonding platform that features ±10µm die placement repeatability. It can perform die, flip-chip, and MCM bonding and process 25 different wafer types/module (all different die sizes) in a single pass. Flexible, modular system architecture allows configuration of the tool for a wide range of assembly requirements, including CABGA, CSP, EPBGA, MCM-L BGA, and PBGA, in addition to almost all types of conventional packages. This modular concept permits direct, in-line connection of up to four modules, all controlled via a single interface, to produce up to 12,000 chips/hour. Each module can be programmed to execute the same task — or meet completely different production requirements — simultaneously. Other features include fully automatic and programmable wafer transfer, substrate support, input/output magazine handling, a chip ejector carousel, and tool changer systems. Kulicke&Soffa Industries Inc., Willow Grove, PA; ph 215/784-6000, fax 215/659-7588, www.kns.com.
Next-generation RTP
 |
The Aspen RTPFR3 is a rapid thermal processing system that is based on the Aspen II platform and is designed to meet the requirements of 0.18µm processing, while satisfying the demands of high-volume manufacturing. The system is based on this company's proprietary susceptor technology, which combines the tight process control of single-wafer RTP systems with the high throughput and low cost of ownership of batch furnaces. The RTPFR3 can process over a wide temperature range (300-1200°C) and can handle both traditional RTP and many furnace applications. The system provides a full suite of leading applications that include silicides, TiSi2 or CoSi2; implant anneals, ultrashallow junctions without "spike anneals;" high-k dielectric anneals (Ta2O5, BST, SBT); glass reflow and /or densification (BPSG, PSG); curing of low-k films; and low-temperature copper anneal. The system moves seamlessly from high-temperature implant anneals to low-temperature copper anneals to lengthier high-k processes that last up to several minutes. Improved thermal isolation keeps the wafer temperature uniformity independent of the process temperature. Mattson Technology Inc., Fremont, CA; ph 510/657-5900, fax 510/657-0165, e-mail [email protected], www.mattson.com.
Compound semiconductor metrology
 |
The PLM-150 is a photoluminescence mapper that gives compound semiconductor fabricators quality assurance data for process control. It features leading-edge speed, wafer handling automation, state-of-the-art analytical power, and it is built for cleanroom operation. Photoluminescence technology is used to screen epitaxially grown wafers to ensure that they meet specifications before undergoing post-epitaxial processing. The technology enables fabricators to assess such parameters as spatial uniformity, layer thickness and composition, and device efficiency. This form of metrology is most often used in the production of LEDs, laser structures, detectors, high-speed devices, VCSELs, and Bragg reflectors. Philips Analytical, Almelo, The Netherlands; ph 519/746-6260 (in the US), e-mail [email protected], www.analytical.philips.com.
Wafer probing system
 |
The EG4/200 addresses wafer probing needs for system-on-a-chip devices requiring a very high Z-force and low-deflection, low-compliance wafer chuck. It has been developed with the same software, user interface, footprint, tester interfaces, and control system as the Horizon 4090 prober family, for quick integration onto existing probe floors. By aligning the Z-force under probe center at all times, deflection is virtually eliminated (the EG4/200 offers up to 150kg Z-force). The prober also offers a large-area, removable scrub block and brush flexible enough to clean almost any probe card type. Native CPU-based vision (PC vision), increases processing speed and allows any standard CPU-based vision software to be run. A large touchscreen monitor (15 in.) enhances viewing and improves control of the EGCommander Plus software. Electroglas Inc., Santa Clara, CA; ph 408/727-6500, fax 408/982-8055, e-mail [email protected], www.electroglas.com.
Patterning generator
 |
Very good linewidth control, high resolution, and a high-speed data path make the Omega 6000 laser patterning generator suitable for the production of photomasks at the 180nm node. The use of an acousto-optic deflector (AOD) for exposure beam deflection has inherent advantages for beam control. The AOD allows a high degree of flexibility and calibration of the beam deflection, generating a very accurate sweep. An advanced auto-focus system, vibration-free linear motors, and a stage with integrated air bearings help to achieve very good linewidth uniformity. The tool uses a raster scan writing strategy. The stage moves at a constant speed along the x axis, and the AOD deflects the laser beam along the y axis. This is repeated until the end of the pattern in the x axis, creating a scan strip along the x axis. After completing a scan strip, the stage retraces in x and moves to the y position for the next scan strip. This process is repeated until the entire pattern area has been covered. Micronic Laser Systems AB, Taby, Sweden; ph 46/8638-5200, e-mail [email protected], www.micronic.se.
Batch dispensing platform
 |
The Century 720 series dispensing platform is a CE-certified system that provides precision dispensing for a broad range of semiconductor applications, including die attach, dam and fill, cavity fill, and chip underfill. As the first stand-alone system to integrate this company's Millennium technology, the 720 workstation offers powerful dispensing capabilities for high-mix, low-volume production and R&D environments. Mass flow calibration ensures consistent, reliable dispensed volumes despite changes in fluid viscosity. Software-controlled, closed-loop, four-channel heating regulates the temperature of the work envelope, offering several levels of control for specific lab and production requirements. The settings and parameters on the Century 720 can be easily transferred to an in-line Millennium platform, ensuring easy transition to production with minimal downtime. This capability allows manufacturers readily to accommodate growth when production needs exceed batch process volumes and allows process developers quickly to switch applications into full production. The platform features an overhead gantry positioning system for fast and smooth acceleration. Robust mechanics and electronics accommodate this company's encoder-controlled linear positive displacement pump and rotary positive displacement valve to handle both standard and specialized dispensing requirements. Asymtek, Carlsbad, CA; ph 760/431-1919, fax 760/431-2678, e-mail [email protected], www.asymtek.com.
Ball bonder
 |
The CBT 6000 ball bonder represents an enabling technology for WsCSP. Users can realize increased productivity and yield in their WsCSP programs by using the 6000's high wire capacity, specialized wafer programming tools, wafer mapping, ink dot recognition, barcode scanning, wafer teach tools, deformation monitoring, and easy-to-use software. In contrast to singulated chip processing, the 6000's large 12 x 6-in. (304 x 152mm) work area allows an entire wafer to be bonded at one time. Using special dual-lane handlers, the 6000 can bond a wafer in one lane while a second wafer is indexing into the other lane. This "Continuous Bonding Technology" completely eliminates index time in wafers of <=6 in. (152mm). Wafer programming tools significantly reduce editing time. By training a master die and the borders of the wafer, the 6000 automatically calculates the array of die that fit in the wafer area and adds the appropriate number of "duplicate" die in the program. Changes to the master die's wire placement, PR points, or bond parameters will automatically cascade to the duplicate die in the program. Palomar Technologies, Vista, CA; ph 760/931-3600, fax 760/931-5191, e-mail [email protected], www.bonders.com.
PROCESS EQUIPMENT
null
Rapid thermal processing
The Radiance Centura is a rapid thermal processing (RTP) system designed for chipmaking at geometries <=0.13µm. Based on production-proven RTP XE technology, it meets the requirements of such advanced applications as ultrashallow junctions and gate oxides, as well as advanced silicides, with extendibility beyond 0.1µm geometries. Fast wafer rotation (240 rpm) and a high-speed, closed-loop temperature control system provide tight temperature uniformity during ramps. Rapid ramp (250°C/sec) and cool-down (90°C/sec) rates limit thermal exposure of the wafer to <3 sec above 950°C for a 1050°C spike anneal. The system also allows closed-loop process control at process temperatures <280°C for next-generation cobalt or nickel silicides. Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, www.appliedmaterials.com.
Post-CMP cleaner
 |
The Vergine post-CMP cleaner uses a vertical wafer transportation, processing, and drying concept that minimizes footprint. Noncontact Jet-Steam cleaning technology uses only DI water for the cleaning process, and the system uses low-speed STR-Spin technology for the lowest wafer stressing and best drying results. The wafer transport system does not use robots, eliminating cross-contamination between different stations. Optional chemistry modules can be added to the cleaning modules for a chemistry spray after the cleaning. Due to its compact, modular design, Vergine can be used as a stand-alone tool or can be easily integrated with all CMP-polishers. The design guarantees full compatibility with 200mm and 300mm wafers. Contrade Microstructure Technology GmbH, Wiernsheim, Germany; ph 49/7041-96000, fax 49/7041-960027, e-mail [email protected], www.contrade.com.
MATERIALS
null
Polysilicon CMP slurry
Semi-Sperse P1000 is a polysilicon slurry that is specifically designed for use in the manufacture of such leading-edge devices as 256Mbit DRAMs. It has a very high oxide-to-silicon nitrate selectivity rate — >300:1 — and it affords low defectivity (surface finish of 3Å roughness), suiting it ideally for polishing polysilicon plugs and exposed polysilicon vias after CVD. These capabilities are equally well suited to emerging process requirements such as polysilicon damascene polishing. Semi-Sperse P1000 offers easy post-CMP clean and high colloidal stability with a shelf life >12 months. Cabot Corp., Microelectronics Materials Div., Aurora, IL; ph 630/585-9471, fax 630/585-9981, www.cabot-corp.com.
Diffusion furnace collars and discs
Hiltex collars and discs give chipmakers extended life and high performance for thermal isolation in furnaces and deposition equipment. They are woven with ultrapure silica (99.9% SiO2), guaranteeing minimum particulate emissions and providing reliable in-service performance; they have very good dimensional stability at temperatures >1100°C and good resistance to thermal shock. Energy saving >12% is realized due to effective insulation properties. All sizes and types are available, including eccentric and tapered collars, and discs with extra or eccentric holes and 1/2 discs. Tystar Corp., Torrance, CA; ph 310/781-9219, fax 310/781-9438, e-mail [email protected].
METROLOGY
null
X-ray inspection system
 |
The NXR-1500 Series automated x-ray inspection/quality assurance test systems deliver fast and repeatable inspections. They are built around this company's advanced x-ray imaging processor, combined with a choice of x-ray sources (up to 130kV) and the AIP II advanced software library. The standard AIP II software provides all the necessary tools for quick analysis and determination of process defects. Test results can be monitored immediately for failure analysis inspection and process verification. The NXR-1500 is highly suitable for inspection of boards using BGAs, flip chips, µBGAs, and other high-density packages. It is a modular, flexible system that requires minimal training to operate, and it is available in semi-automated or programmable models. Nicolet Imaging Systems, San Diego, CA; ph 858/635-8600, fax 858/695-9902, e-mail [email protected], www.nicimg.com.
Ion beam etch endpoint detector
 |
The IMP series endpoint probes, for ion beam etch processing, allow etch endpoint determinations to 2.5Å for multiple species, in real time. Endpoints are routinely and repetitively identified for layers to 10Å (four atoms) thick, and layers masked to 99%. Inter-layer diffusivity is positively established. The SIMS technique is used to ensure total immunity from optical contamination, together with long-term and reproducible precision and sensitivity. The flexible EPD control suite is programmable to determine endpoint on both increasing and decreasing species intensity, and additionally incorporates an overetch mode selectable for both fixed process time and fixed percentage total time. Probe mounting is custom-engineered to accommodate a broad range of process systems and orientations, standard options encompassing diverse probe insertion lengths and both axial and off-axis ion acceptance configurations. Hiden Analytical Ltd., Warrington, UK; ph 44/1925-445225, fax 44/1925-416518, e-mail [email protected], www.hiden.co.uk.
HARDWARE/ACCESSORIES
null
Integrated sealing and motion system
The Drivethru is a complete "plug-and-go" system that provides controlled rotation in a vacuum chamber. It provides compact, high-performance integrated sealing and rotation, and it has a water-cooled magnetic rotary seal supported by large section cantilevered bearings, an integral multipole motor and sensors, a matched drive amplifier, and all cabling. Rotation in a vacuum is often slow movement with accurate positioning or high-speed rotation with accurate speed control, and Drivethru provides solutions to both. Motors range from a few hundred watts to several kilowatts, speeds from indexing to 15,000 revs/min., accelerations to 600 rad/sec2, and positional resolution to 0.001°. Advanced Fluid Systems, UK; ph 44/171-622-8800, fax 44/171-498-2530.
Air-cooled Nd:YAG lasers
 |
The X30S family of Nd:YAG lasers are designed for high-precision materials processing applications, including semiconductor wafer marking. They are compact, diode pumped solid state lasers that deliver Q-switched output with moderate average power (>6 W at 1064nm) and high peak power, at repetition rates up to 100 kHz. Their output also features good spatial mode quality (M2 < 1.2), together with high spatial mode stability and very good pulse-to-pulse stability. The result is a laser beam that can be easily focused to a small spot at the work surface and which provides highly consistent output for good process control and high yields. The combination of high peak power and a near diffraction limited beam also leads to efficient harmonic generation, with average power >3 W at 532nm. Spectra-Physics, Mountain View, CA; ph 650/966-5882, fax 650/961-9049, e-mail [email protected], www.spectra-physics.com.
Small-profile linear motor stage
The Impulse stage offers linear motor performance in a very low profile — 50mm high. Its brushless servo linear motor can be sinusoidally commutated for great smoothness and — with its high-resolution linear encoder — achieves 5Gs, 3m/sec and ±100nm repeatability. Design details achieve torsional stiffness to 0.2 kg-m/arc-sec and enclose cables to minimize particle generation. Standard travels range from 150mm to 350mm with convenient x-y stacking. New England Affiliated Technologies, Lawrence, MA; ph 978/685-4900, fax 978/688-8027, e-mail [email protected], www.neat.com.
Semiconductor feedthrough/actuator
 |
ChamberLink is a combination feedthrough and precise harmonic drive servo actuator in one stainless-steel device. It provides high-powered, precisely controlled motion within a vacuum chamber. Because the device has no chamber-wall-penetrating shafts that require seals, vacuum leakage is avoided. ChamberLink seamlessly integrates the harmonic drive with the chamber wall, keeping the motor and input elements on the chamber's ambient side while the geared output shaft moves on the vacuum side. Harmonic Drive Technologies, Peabody, MA; ph 800/921-3332, e-mail [email protected], www.harmonic-drive.com.
Diaphragm pump replacement parts
The ReBound line of diaphragm pump replacement parts is designed as a high-quality, low-cost alternative to OEM parts. The parts are intended for pumps that move solvents, electroplating chemicals, etching acids, and polishing compounds. The ReBound line includes diaphragms, check balls, seats, and O-ring seals for Wilden, Versamatic, Warren Rupp, and ARO air-operated, double-diaphragm pumps. The parts are made to be interchangeable, so no costly retrofitting is needed to install them. ReBound Products, Spring, TX; ph 888/660-7759, fax 281/820-1647.
CONTAMINATION CONTROL
null
Point-of-use resist filter
 |
The Falcon PE-Kleen photoresist filter is constructed entirely of high-density polyethylene, allowing spontaneous wettability in solvent-based resists. This minimizes photochemical waste by providing quick start-up, minimized bubble generation, and consistent performance. Low pressure drop is ensured by use of this company's patented crescent-shaped Ultipleat filter configuration. The Falcon PE-Kleen is highly suitable for low-pH antireflective coatings and for DUV resists; good compatibility, low extractables, high retention characteristics, and good wettability suit the new filter to point-of-use applications. Captured O-ring design makes changeout simple, and the filter is designed to retrofit most resist dispensing systems. Pall Corp., East Hills, NY; ph 516/484-3600 or 800/645-6532, fax 516/484-3637, e-mail [email protected], www.pall.com.
FAILURE ANALYSIS
null
300mm failure analysis tool *** Plasmalab µEtch 300 has been specifically developed for in-line 300mm wafer deprocessing and features computer-switchable PE/RIE modes and integration of a laser endpoint detection system into the PC control software. The tool's footprint is 0.6 m2, well suited to FA/QA labs, where space is at a premium. It is capable of removing passivation layers causing the minimum of damage and of anisotropic removal of intermetal dielectrics for full defect location and identification. Uniformity across a 300mm wafer has been demonstrated at <±5%. Oxford Instruments Plasma Technology, Bristol, UK; ph 44/193-483-3851, fax 44/193-483-4918, e-mail [email protected], www.oxfordplasma.com.
SOFTWARE
null
Off-line recipe editing
DREAM (distributed recipe editor access manager) Server is a Windows NT server based application for editing process recipes using Visual Recipe Editor (VRE) off-line with parameter level security. It gives chipmakers a flexible method for creating and maintaining various recipe-editing groups. Each group can have individual users with specific access levels for off-line recipe editing. The most impressive feature of DREAM is an ability to define up to parameter level security for each individual VRE user. This is useful in reducing unauthorized editing of recipe parameters for each process recipe, and it will enable process engineers to access recipes using corporate or fab Intranets to edit recipes off-line. The system can co-exist with network security management systems in the fab. Sapphire Software, Fremont, CA; ph 510/413-4970, fax 510/413-4973, e-mail [email protected], www.sapsoft.com.
VACUUM EQUIPMENT
null
High-vacuum deposition system
 |
The Mark 50 is a high-vacuum deposition system that offers precision coating of flexible substrates, a load lock chamber for source isolation, and interactive computer control of system operation. Using a special web roll fixture, it can coat a wide variety of flexible substrates, such as FPDs, solar cells, flexible printed circuits, electromagnetic shields, and capacitors, as well as coating thin plastic and copper foil, ITO, AR film, and magnetic tape. A roll of substrate is fed by the system's deposition source at speeds controlled by a precision digital drive system, ensuring optimum throughput with high film uniformity. The Mark 50 is available with a slide-out load lock chamber that is designed to isolate the source from the process chambers during operation. When equipped with this feature, the deposition system's process chamber can be independently pumped to high vacuum before exposing the source chamber to the process chamber. Predeposition processes such as preheat, ion beam etch, and RF etch can be performed in the process chamber when isolated from the source. CHA Industries, Fremont, CA; ph 510/683-8554, fax 510/683-3848, www.chaindustries.com.
GAS/GAS HANDLING
null
High-purity pressure dial gauge
 |
The SDG high-purity pressure dial gauge is designed for applications that require a high degree of cleanliness, performance, and durability. Packaged in a stainless steel housing with a 2-in. dial face and 316L SS wetted parts, it has an easy-to-read dual range scale. Ranges from -30 in. HG to +0 up to -30 in. HG to +3000 psig are available. The SDG is also available with male or female face seal fittings in a back mount or stem mount configuration. All the gauges are electropolished, helium leak tested to 1 x 10-9 atm cc/sec, and calibrated and assembled in a Class 100 cleanroom. Using Bourdon tube technology, the SDG offers Grade A ±1% full-scale accuracy per ANSI B40.1. It is operable in ambient temperatures from +4° to +212°F (-20° to +100°C) and process media temperatures of +14° to +131°F (-10 to +55°C) without degradation to performance. Setra Systems Inc., Boxborough, MA; ph 800/257-3872 or 978/263-1400, fax 978/264-0292, e-mail [email protected], www.setra.com.
LITHOGRAPHY
null
Bump process lithography tool
The Saturn Spectrum 3 wafer stepper is designed specifically for bump (flip chip) process applications. The system uses new broadband ghi-line optics technology and is capable of processing any g or i-line photosensitive film from 1.0 to >100µm thick on the same stepper. With 2.0µm resolution and a usable depth-of-focus >5.0µm, the system provides a high degree of process latitude. It is equipped with a fully automatic wafer-size change feature that allows back-to-back processing of wafers ranging in diameter from 4 to 8 in. High wafer-plane irradiance results in low exposure times and high throughput at high dose exposures. Ultratech Stepper Inc., San Jose, CA; ph 408/321-8835, fax 408/577-3379, e-mail [email protected], www.ultratech.com.