Patterned wafer defect inspection
10/01/1999
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EAGLE is a fully automatic patterned defect inspection system (for 150 to 300mm wafers) that features high-speed automatic die mask design for even the smallest design rules. The system provides sensitivity of better than 0.150µm on patterned wafers; it features multiple beam illumination and continuous motion imaging for throughput of up to 60 wafers/hr (200mm). A high-speed image processing computer architecture with a Windows NT GUI offers recipe setup time of <30 min. for logic devices and DRAMs. The wide dynamic automatic dark field masking in pixel-size resolution provides the fundamental prerequisite for detailed, high-resolution die-to-die comparison. The built-in, high-quality optical microscope, in combination with field-proven defect classification software, provides a self-learning automatic defect classification (ADC). The ADC results are presented by the built-in data management system, including overlay and pareto charts. Macrotron Systems GmbH, Munich, Germany; ph 49/89-45111-146, fax 49/89-45111-105, e-mail [email protected].
Nitride deposition system
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SiNergy Centura is a single-wafer LPCVD system for depositing critical silicon nitride film layers in transistor structures of <0.18µm devices. It allows chipmakers to decrease a wafer's thermal exposure by more than an order of magnitude compared with furnaces, to make possible sensitive sidewall spacer, etch stop, shallow trench isolation layers, and other applications. Providing better control over dopant diffusion - which is critical for maintaining electrical performance - the process is performed in minutes, rather than the hours required for batch furnaces. The system's SiH4 chemistry eliminates formation of NH4Cl and allows a fourfold improvement in particle performance over furnaces. SiNergy uses proprietary Remote Plasma Clean technology, which further reduces particles, boosts throughput, extends hardware and consumables lifetime, and emits almost no global-warming gases. The system's xZ chamber uses a dual-zone ceramic resistive heater that provides very good temperature uniformity and productivity over a wide range of temperatures and pressures. High throughputs are achieved by varying the deposition rate and holding total process time constant. The SiNergy platform can be configured to hold up to four process chambers.Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, www.appliedmaterials.com.
Die bonding platform
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The 2008 die bonding platform functions as a high-accuracy die attach tool, performing optimally in applications such as BGA and other substrate-based packages for which high-accuracy placement is essential. The bonder has a new pick-and-place module that performs up to 11,000 dry cycles/hour. Die placement accuracy of 25µm at 3s or 8.3µm at 1s can be achieved. A newly designed advanced vision system incorporates optical bond centering that locates and centers the bond pad, increasing the accuracy of the die placement. The tool's bondhead design allows bond force control and a high-resolution theta alignment of 10,000 increments. A fast and flexible epoxy dispenser that can be used in writing and showerhead modes is also incorporated into the platform.ESEC, Cham, Switzerland; ph 41/41-749-5111, fax 41/41-749-5777, e-mail [email protected]; in the US, ph 602/893-6990, e-mail [email protected]; www.esec.com.
Motion and machine control system
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The BXi controller is designed specifically for automated semiconductor process tools. It features eight internally powered servo axes, an expandable 100-Mbit Ethernet I/O system, and an object-based development environment. A powerful RISC-based processor core drives the system. This highly integrated feature set enables the BXi to control almost all servo motor-driven wafer handling equipment, such as multiaxis robots, notch-aligners, and pod door openers. Because it resides on an Ethernet network, machine data down to the sensor level can be accessed through the corporate intranet or anywhere in the world via the Internet. Measuring approximately 10 x 3 x 8 in., the tool is very compact. This company's Autocalibration technology eliminates time-consuming robot teaching and long robot replacement times. Using a variety of application-specific methods, Autocalibration allows a robot to locate tool points precisely without the need for operator assistance, reducing this process from several hours to a few minutes. Other features include predictive maintenance, robot self-diagnostics, and machine-wide error handling.Berkeley Process Control Inc., Richmond, CA; ph 510/236-3333, fax 510/236-1186, e-mail [email protected], www.berkeleyprocess.com.
Ion implantation system
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Quantum extends high-current implant technology to 0.1µm device geometries and 300mm wafers. Built on a small-footprint platform that bridges 150, 200, or 300mm wafers, it operates with very high throughput and productivity at the low energies (to 200eV) required for advanced chip designs. The system incorporates a 300mm-compatible factory automation module for fully automatic wafer handling, but is almost the same size as this company's compact 200mm xR LEAP system. Maximum 200mm mechanical throughput range has been extended from the xR LEAP to doses of 1E15, while the system achieves a 60% throughput increase when used for quad implants. Quantum's very short source-to-wafer beam path, which minimizes beam "blow up" and energy contamination, has been further optimized to improve precision at all energies. New technology ensures very good energy accuracy and improved energy control for ultralow energy implants to ±7.5 V. Three Quantum models offer ranges of 200eV to 80keV, 2keV to 80keV, and an optional package that boosts energy to 120keV.Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, www.appliedmaterials.com.
Optical wafer inspection
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The 2139 optical wafer inspection system, offered as a new system or as an upgrade to existing 2135/38 systems, is optimized for line monitoring applications during lithography and etch processes, as well as for engineering analysis. Featuring ultra-broadband brightfield illumination and high numerical aperture optics, the 2139 extends raw sensitivity by up to 20% by introducing a new 0.16µm pixel. Users can achieve extra sensitivity enhancement via AutoSAT software, which reduces the complexity and time associated with creating a segmented auto threshold (SAT) inspection. Simplifying SAT setup increases the adoption of this powerful technology, which allows exceptional detection sensitivity on hard-to-inspect layers that have process-induced noise such as color variation and grain. A new high-resolution camera and improved review optics provide higher sensitivity to critical defect types and improves the accuracy of automatic defect classification.KLA-Tencor Corp., San Jose, CA; ph 408/875-7039, e-mail [email protected], www.kla-tencor.com.
Copper electrolytes
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Part of the MOSAIC (Metallization and Organic Solutions for Advanced Integrated Circuits) product family for dual damascene interconnects, these two series of electrolytes are customized for different equipment configurations. The Nanoplate 2001 series is designed for use with Semitool plating equipment, and the Ultrafill 2001 is optimized for Novellus tools, but can also be used with other plating equipment. Each series includes an electrolyte solution with a suppressor and an additive to enhance fill performance. Both electrolytes provide consistent, seamless filling of sub-µm trenches and vias, with demonstrated capabilities of bottom up plating on features <0.15µm and aspect ratios >7:1. The products are filtered to 0.1µm to ensure the highest purity and lowest contamination, and they are designed and tested to work optimally with other materials in the MOSAIC family to achieve a successful dual damascene copper plating process. Shipley Co., Marlborough, MA; ph 508/229-7496, fax 508/229-0254, e-mail [email protected].
Liquid particle sensor
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Designed specifically for deionized (DI) water, the Ultra DI 50 monitors particulates during the manufacturing process. It counts and sizes contaminants as small as 0.05µm and operates using a high sample volume, providing meaningful statistical data for very clean water systems. The high sample flow also allows an operator to clean up quickly between stations. The sensor is made from smooth, nonshedding material and is resistant to most cleaning solvents. A status indicator on the sensor displays laser, power, and activity. Four sizing channels are available to enable operators to analyze specific sizes of interest. Data collected from the Ultra DI can be directly transmitted using an Ethernet connection to a workstation for real-time analysis, and the Facility-View software package provides a comprehensive account of real-time or retrieved particulate data in different formats for operators to review. For situations where a local display configuration is needed, information can be transmitted to a touchscreen data acquisition system called Data Touch. The operator views all collected data on one screen representing a tabular display, sample plot, status conditions, and system parameters.Particle Measuring Systems Inc., Boulder, CO; ph 303/443-7100, fax 303/449-6870.
Laser diode spectrometer
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Laser diode spectrometry (LDS) is a new metrology tool for elemental contamination monitoring that is based on atomic absorption spectrometry. Use of laser diodes as radiation sources offers much improved performance - lower detection limits, better selectivity, and greater dynamic range. Applications include quality control of ultrapure water and ultrapure chemicals, wafer surface contamination monitoring by coupling with VPD sample preparation, and contamination control of relevant elements in the ppt range (e.g., monitoring of light elements Al, Ca, K, and Na, and of key elements Al, Cu, Fe, and Na). Features of the LDS-800S spectrometer include: fully automated sequential monitoring of up to four chosen elements in the ppt range; low detection limits (<10 ppt) and high selectivity; the capability to be used in the fab during device fabrication, as well as in the analytical lab; and a mobile rack mounting option that affords both on-site and on-line utility. LaserSpec Analytik GmbH, Munich, Germany; ph 49/89-32-46440, fax 49/89-32-464410, [email protected], www.laserspec.de.
Defect-review SEM
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Using OperatorFree EDX (energy dispersive x-ray) analysis, the SEMVision cX features automatic material identification that characterizes defects on unpatterned wafers. The system also offers high-productivity operation at 500 defects/hour and color MPSI (Multiple Perspective SEM Imaging) for enhanced topography and material information. These features work together to give chipmakers fast, reliable defect information on both patterned and unpatterned wafers, alerting them to process excursions and helping identify the defect's source for faster time to correction. EDX technology uses x-ray spectroscopy to identify the precise material composition of many defect types so that users can determine their source. Materials information is combined with automated defect classification to provide engineers with all vital defect data. The automated EDX is used to analyze unpatterned wafers such as monitor wafers and those with blanket films or planarized surfaces. Although previous technologies could determine bulk defect density on a wafer, SEMVision cX lets chipmakers go directly to a higher order of information - Classified Defect Density - which automatically classifies defects by type (particle, scratch, buried layer, etc.), materials properties, and other characteristics. Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, www.appliedmaterials.com.
Noncontact in-line placer
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Shorter runs, faster turnarounds, and a continuously evolving mix of components featuring higher lead counts and finer pitches place great demands on pick-and-place equipment. The CP-40CV fine pitch placer has a powerful combination of CyberOptics laser sensors on all of its three heads and 256-level gray-scale bottomside vision. The lead-screw-driven machine places a large array of components, from 0402s up to 40mm2 QFPs with pitches down to 0.3mm, including SOPs, BGAs, microBGAs, and connectors. The tool holds 104 tape feeders, as well as standard and belt-driven stick feeders and waffle-pack trays. Advanced software provides real-time machine operation, auto-optimization, and on-screen error display. CP-40CV includes a three-stage conveyor for fast PCB transport; large and palletized PCBs (18 x 16 in.) are easily accommodated. Manncorp, Huntingdon Valley, PA; ph 215/364-6100, fax 215/364-6110, e-mail man [email protected], www.man ncorpdirect.com.
Automatic flow controller
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Model 401 Liquid Flo-Controller is a completely automatic, all-Teflon flow controller that needs only a 24VDC power source and liquid flow. It can measure and control flow as low as 15mL/min or as high as 8L/min, and works well in ultraclean fluids applications. The all-Teflon and sapphire wetted parts do not affect process chemicals and solutions. The 401 uses a miniature turbine wheel and infrared beams to achieve 10:1 or better turndown ratios with repeatability of +/- 0.25% full scale and accuracy of +/- 2% full scale. It can be used as a stand-alone system by simply powering the controller and making the appropriate flow connections, setting the adjustable setpoint to the desired flow rate and letting the system control. Model 401 can be easily interfaced with existing control systems by using the 4-20mA inputs and outputs. McMillan Co., Georgetown, TX; ph 800/861-0231 or 512/863-0231, fax 512/863-0671, e-mail [email protected], www.mcmillancompany.com.
TEOS effluent management
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The HPS TEOS effluent management subsystem controls condensable exhaust products from TEOS-based LPCVD systems. It is an integrated system that combines a nitrogen barrier created by the Virtual Wall, heating from Series 45 heater jackets, and a high-conductance, room-temperature TEOS trap. The result is a longer time between preventive maintenance cycles, faster maintenance of the exhaust system and pump, and the elimination of clog-induced pump failures. LPCVD using TEOS is a popular precursor for the deposition of silicon dioxide as an interlayer dielectric film, but it has a propensity to clog the vacuum pump line with solid and viscous-liquid effluent byproducts, increasing particle levels, impeding gas flow, and potentially causing catastrophic pump failure. This new system provides the correct combination of a nitrogen boundary layer near the inner physical wall of the pump line at the reactor pumping port, optimized pump line temperature, and an innovative turbulent-flow trap.MKS Instruments/Vacuum Products Group, Boulder, CO; ph 800/345-1967 or 303/449-9861, fax 303/442-6880, www.mksinst.com.
Delineation of oxide layers in SEM images
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New Delineation Etch gas chemistry, for DualBeam systems, delineates oxide layers in SEM images of FIB-milled cross-sections. This capability replaces multiple manual operations outside the fab with an integrated, in-fab, cut-etch-and-view capability on intact wafers. The gas is noncorrosive to copper and does not require special handling techniques. With Delineation Etch, DualBeam tools can precisely locate an area of interest, automatically ion-mill a cross-section, gas-etch the exposed surface to delineate layers, and acquire a high-resolution SEM image of the revealed structure - using a single, automated system. Delineation Etch works in conjunction with the ion-beam within the FIB/SEM sample chamber, etching different materials at different rates, depending on material composition and deposition conditions. The topographical relief created between layers by this differential etching is highly visible in SEM images. FEI Co., Hillsboro, OR; ph 503/844-2695, www.feic.com.
Flip chip die bonding platform
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Model CDB-50 is an automatic flip chip die bonder that is granite-based and can grow from a semi-automatic configuration to a fully automatic one based on user requirements. The machine can accept a wafer handler with a flipper and from one to four 8-in. wafers with die sizes varying from 0.3mm to 25mm. The automatic substrate handler can load and unload boats, boards, and frames constructed of materials such as Flex, FR-4, PWB, and ceramics. Additional die presentation options are waffle packs, gel packs, and tape feeders. The system is designed to perform high-accuracy and high-force flip chip/die bonding in all modes of operation, from prototyping to full production. It handles chips up to 1 in. in size and can place various die onto different-sized substrates up to 10 x 10 in. (a custom program is available for larger sizes). Forces, temperature profiles for upper and lower chucks, and timing parameters used for bonding are fully programmable. The tool's optical alignment system gives accuracies of 2µm or better. An innovative planarization system allows the die to be leveled to a substrate with nonreflective surfaces. RD Automation, Piscataway, NJ; ph 732/572-4800, fax 732/572-4808, www.rdautomation.com.