RF generators with plasma stabilization
10/01/1999
These RF generators include S-technology, a new stabilizing technology that greatly reduces the interaction of the plasma chamber-matching network load with the generator. S-technology eliminates the oscillations that may occur during process tune-in or whenever process conditions change. This increased stability reduces process development time, improves process repeatability, and increases the life of the matching network and the RF generator. Comdel Inc., Gloucester, MA; ph 800/468-3144, fax 978/282-4980
Compound turbopumps
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These corrosion-resistant compound turbopumps (50-3400 l/sec), with a self-diagnosed module built in, have a MTBF benchmarked at >6 years. Improved rotor and blade design allows the pumps to evacuate continuously over 3500 sccm argon. The production version is now available for all LCD, TFT, rigid memory, thin film head, and DVD processes. Osaka Vacuum, SanJose, CA; ph 408/441-7658, fax 408/441-7660, e-mail [email protected].
300mm failure analysis tool
Plasmalab µEtch 300 has been specifically developed for in-line 300mm wafer deprocessing and features computer-switchable PE/RIE modes and integration of a laser endpoint detection system into the PC control software. The tool's footprint is 0.6 m2, well suited to FA/QA labs, where space is at a premium. It is capable of removing passivation layers causing the minimum of damage and of anisotropic removal of intermetal dielectrics for full defect location and identification. Uniformity across a 300mm wafer has been demonstrated at <±5%. Oxford Instruments Plasma Technology, Bristol, UK; ph 44/193-483-3851, fax 44/193-483-4918, e-mail [email protected], www.oxfordplasma.com.
CMP and etch metrology systems
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The Matrix S200 CMP has a small (5 x 10µm) spot 633nm HeNe ellipsometer for on-product substrate n and k measurement and a microspot (2.5µm) visible reflectometer (470-905nm) for high-throughput film thickness measurement (120 wafers/hr). The addition of a visible reflectometer allows high-throughput measurement of thicker films, as well as single-recipe measurement of all forms of polysilicon. The S200 Etch system combines the features of the S200 CMP with a 780nm ellipsometer and software optimized for etch-to-clear applications. It makes possible reliable ultrathin trace residue (under-etch) detection and sensitive, accurate over-etch detection. Both systems feature fast and robust Zheng pattern recognition, which has very good performance under low-contrast conditions and very high immunity to color and contrast variation. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, fax 973/691-5480, www.rudolphtech.com.
Lithography data analysis
ProDATA Version 2.0 is a software tool that is designed to import, analyze, and visualize experimental data and provide optimum lithographic process information in seconds. The software analyzes swing curves, contrast curves, and focus-exposure data and uses advanced analysis algorithms to provide results. Many new features make analysis more accurate for such tasks as: determining the process window and depth-of-focus (DOF) of experimental and simulated focus-exposure data; determining the overlapping region of any number of process windows and the resulting DOF curves; analyzing DOF using either rectangles (for systematic errors) or ellipses (for random errors); analyzing CD, Eo, or reflectivity swing curve data to determine the minima, maxima, swing ratio, and period; and analyzing H-D contrast curve data to determine dose to clear and photoresist contrast. FINLE Technologies Inc., Austin, TX; ph 512/327-3781, fax 512/327-1510, www.finle.com.
Mass flow controllers
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The 1640 pressure-based mass flow controller (MFC) and the M330B thermal-based MFC have been qualified by ATMI and can achieve gas utilization of up to 90% with Matheson's Safe Delivery System (SDS) gas sources. The two instruments cover gas flow control ranges down to 5 sccm at pressure drops approaching 5 torr. The 1640 accurately measures flows using an orifice and a pressure transducer. The flow is controlled using the pressure signal and a control valve. It operates in the critical flow regime, where pressure is proportional to flow, and has an internal Baratron pressure sensor to monitor the pressure. The M330B uses a new sensor design that accurately measures gas flows as low as 5 sccm with a 5 torr pressure drop and 100 sccm with a 15 torr drop. It can be used for higher flow SDS applications, such as CVD and low-flow ion implant. MKS Instruments Inc., Andover, MA; ph 800/227-8766 or 978/975-2350, fax 978/975-0093, www.mksinst.com.
Cleaning chemistries
EKC4000 PCT aqueous solutions focus on safety by eliminating the potential fire hazards associated with such rinses as IPA and NMP. The 4000 series also has no SARA Title III ingredients, reducing environmental reporting requirements. The products operate at room temperature with a low evaporation rate, which extends the bath life of the chemistry and provides for lower chemical consumption and operating costs. EKC5000 products clean copper containing post-etch residue or photoresist without damage to the exposed copper or the structures around it. They are designed for use with advanced interconnects for both damascene and dual damascene structures. EKC6000 semi-aqueous remover products, which can clean residue at or below critical dimensions of 0.25µm, require very short cycle times to perform, often eliminating up to 80% of the cleaning time. They can be used with single-wafer, batch, and spray process equipment. EKC Technology Inc., Hayward, CA; ph 510/784-9172, fax 510/784-9181.
Small-profile linear motor stage
The Impulse stage offers linear motor performance in a very low profile - 50mm high. Its brushless servo linear motor can be sinusoidally commutated for great smoothness and - with its high-resolution linear encoder - achieves 5Gs, 3m/sec and +/- 100nm repeatability. Design details achieve torsional stiffness to 0.2 kg-m/arc-sec and enclose cables to minimize particle generation. Standard travels range from 150mm to 350mm with convenient X-Y stacking. New England Affiliated Technologies, Lawrence, MA; ph 978/685-4900, fax 978/688-8027, e-mail [email protected], www.neat.com.
Automated bump inspection
The NSX B-100 is a high-speed, dedicated bump inspection system for the wafer level packaging industry, including flip chips and chip scale packaging. It inspects for all common bump defects, including bump presence, diameter, shape, placement, and defects on bumps. For enhanced process control, the built-in bump metrology and positional automated defect classification feature allows for the highest level of data analysis. The system inspects whole wafers and sawn wafers on film frame, and die in gel/waffle packs, JEDEC trays, MCMs, Auer boats, and other package configurations. August Technology, Edina, MN; ph 612/820-0080, fax 612/820-0060, e-mail [email protected], www.augusttech.com.
Dry vacuum pumps
Brushless DC motors power the AA series dry vacuum pumps, permitting higher rotational speeds and delivering more performance in a smaller physical package. The highly efficient motors reduce energy consumption, lowering operating costs and reducing generation of greenhouse gases. The "smart" controllers start booster pump rotation at atmospheric pressure, cutting pumpdown cycle time, with almost no inrush current. Pumping speeds range from 46 CFM (1300 lpm) to 635 CFM (18,000 lpm). An optional corrosion-resistant main pump provides extended service in chemically aggressive processes such as metal etch. Ebara Technologies Inc., Sacramento, CA; ph 978/465-1983, fax 978/465-5264, www.ebaratech.com.