Technical Program
10/01/1999
Semicon Southwest '99 Preview
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Technical Program
October 17-23
Austin, TX
Semicon Southwest '99 programs and events begin Sunday, October 17, and continue through Saturday, October 23. The exposition will be held at the Austin Convention Center on Tuesday, October 19, from 10 am-6 pm, and on Wednesday, October 20, from 10 am-5 pm. All fees listed in this article refer to registration after September 17.
 Show attendees will gather at the Austin Convention Center. (Photo courtesy Austin Convention Center) |
Since many programs and events sell out quickly, Semi recommends that you check the availability of programs before registering by visiting the Semi web site at www.semi.org. On-site registration opens Monday, October 18, at 7:30 am.
As in years past, the International Electronics Manufacturing Technology (IEMT) Symposium will be held at the Austin Convention Center simultaneously. The symposium runs from Monday, October 18, to Tuesday, October 19. A description of this technical program is found at the end of this preview.
SUNDAY
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How to Successfully Manage
New Product Introductions
Sunday, Oct. 17 - Monday, Oct. 18
8:00 am-5:00 pm
Austin Convention Center
Fierce competition, rapid technological change, and failure to see the end of a technology or the effectiveness of a new one can be very costly. Today, the cost of a failure in a technical product introduction can be fatal.
This two-day interactive course looks not only at the success criteria for market-driven products, but also takes a close look at the strategic impact the new product has on the company itself. The course emphasizes a professional review of the processes and techniques of managing a successful product introduction. Specific metho dologies are addressed for handling ROI, cash flows, forecasts, advertising, and other management-visible areas. The course also analyzes the ramifications of assumptions and decisions about the marketplace and the new product introduction on the company. Students will work with industry case studies to develop new product introduction plans.
Who should attend: This course is for marketing professionals, multifunctional managers, engineering managers, and senior executives. Casual business attire is appropriate.
Instructors: David Jimenez, Wright Williams & Kelly;Walt Ferguson, Wright Williams & Kelly; Michael Wright, EMPAK
Registration fee: $1450.
Lithography Science
Sunday, Oct. 17
9:00 am-5:00 pm
Austin Convention Center
This course begins with an inclusive discussion of the basic principles of optical lithography, and progresses to topics that represent today's state of the art. Presentations focus on the fundamentals of optics, focus, thin film interference effects, resist chemistry and characterization, wafer steppers, overlay, reticles, yield, and metrology. Also included is an introduction to lithog raphy modeling, for both imaging and overlay. Solutions to certain problems, such as the application of antireflection coatings to address thin film optical effects, are discussed. Math is used where appropriate, but is kept simple to ensure that concepts are not lost in the equations. Ad vanced topics include optical proximity corrections, off-axis illumination and phase-shift masks, and possible alternatives to optical lithography, such as x-ray, e-beam, and ion-beam technologies.
Instructors: Harry Levinson, DUV Lithography Development Project Leader, Advanced Micro Devices
Registration fee: $550.
Step: Semi E79: Standard for the Definition and Measurement of Equipment Productivity
Sunday, Oct. 17
1:00-5:00 pm
Austin Convention Center
Semi Standard E79, which defines the metrics and calculations for the measurement of equipment productivity, has been the focus of considerable discussion since its passage in July 1998. This Semi Step (Standards Technical Education Program) will describe Semi E79-0299, review its use in industry, and suggest revisions. Experienced productivity experts with different points of view will discuss the application of this new standard in addressing issues of equipment productivity, productivity improvement, and factory management.
Chair: Jim Irwin, Irwin Consulting
Who should attend: Anyone with a stake in fab productivity improvement, equipment supplier design, marketing, and service management; and fab engineering, procurement, manufacturing, planning, and scheduling and productivity improvement team leaders.
Registration fee: $295.
Winning Customer Satisfaction...without Stress
Sunday, Oct. 17, 8:30 am-5:30 pm
Monday, Oct. 18, 8:30 am-4:30 pm
Austin Convention Center
Many professionals in semiconductor equipment and materials sales, service, and marketing are drawn from technical fields. This workshop will help ease this transition by teaching the interpersonal skills needed for these new positions. In this workshop, you will learn practical techniques for resolving difficult situations, as well as learning how to maintain a calm, rational presence in stressful circumstances while being able to defuse anger and upset.
The focus of this workshop is two-fold:
- to identify the core realities of situations, and
- to recognize and modify, through a heightened self-awareness, those inappropriate behavior patterns that interfere with communication.
The stress part of this workshop is based on the University of Michigan study on Developing Psychological Hardiness.
Who should attend: Service managers, service and administrative personnel, and other industry professionals who interact directly with either internal or external customers.
Instructors: Cole Baker, The CompoGroup
Registration fee: $1095, including Customer Satisfaction workbook, related reading materials, memory aids, and a customer interface checklist.
MONDAY
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A Partnership for PFC Emissions Reduction
Monday, Oct. 18
9:00 am-5:00 pm
Austin Convention Center
Co-sponsored with SIA, SSA, and International Sematech. This workshop is intended to provide information on new and recent developments in PFC emissions reduction technologies and activities. It will provide useful information to companies in planning their PFC emissions reduction strategies under the recently completed WSC agreement. End users, equipment producers, and chemical suppliers will all benefit from this seminar. Both process and ESH specialists, as well as those managing these activities, will find value in the information presented. As part of this workshop, results of recent developments in process optimization, capture
eclaim, alternative chem istries, and abatement will be shared. Status reports on both the WSC activities worldwide, and the IPCC activities around quantifying PFC emissions, will also be presented. The reception after the workshop is sponsored by International Sematech and Air Products and Chemicals.
Chairs: Laurie Beu, Motorola; Mike Mocella, DuPont
Who should attend: Semiconductor manufacturers, equipment suppliers, chemical suppliers, regulatory officials, and academia.
Registration fee: $295. For more information, contact Lisa Marsella, Semi, at ph 650/940-6957 or e-mail [email protected].
TUESDAY
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Equipment and Materials Market Briefing
Tuesday, Oct. 19, 8:30-9:30 am
Austin Convention Center
Responding to the need for worldwide market information in a rapidly changing industry, Semi Market Statistics provides attendees with accurate, timely industry benchmarks for market size and product sales trends. This one-hour briefing by Semi market analyst, John Schuler, offers a look at the worldwide semiconductor equipment and materials markets.
Who should attend: Presidents, VPs, and other senior professionals in marketing, finance, sales, consulting, and product planning.
Registration fee: $150.
Overall Equipment Effectiveness: Improving Equipment Productivity
Tuesday, Oct. 19, 9:00 am-5:00 pm
Austin Convention Center
As wafer fabrication technologies become better characterized and more stable, the competitive focus is shifting to equipment efficiency. Cost of ownership, total productive manufacturing, total productive maintenance, overall equipment effectiveness, multi-observational study, and theory of constraints are techniques aimed at defining, measuring, and improving equipment performance. These calculations have recently become important tools for IC producers contemplating equipment purchases. The instructors use their industrial engineering training and extensive fab floor experience to provide tools for benchmarking and communicating equipment productivity to IC manufacturers.
Instructors: John Fowler, Arizona State University, Jose Padillo, TEFEN Ltd.
Registration fee: $695, including Improving Equipment Productivity workbook.
Software Management for Senior Executives
Tuesday, Oct. 19, 9:00 am-5:00 pm
Austin Convention Center
This course provides a process-based strategy founded on proven software engineering methods for improving the management and development of software-intensive systems within the semiconductor industry. The objectives of the course are to deliver an intensive, coherent review of software management issues and practices and to bring existing expertise up to date with current knowledge that senior executives can use.
Who should attend: This seminar is not for software managers or engineers. It's specifically designed to help executives understand software issues.
Instructor: Harvey Wohlwend, Sema tech program manager for software improvement
Registration fee: $450.
"Copper Critical" Readiness Briefing
Tuesday, Oct. 19, 10:00-11:00 am
Austin Convention Center
Cosponsored by Philips Analytical.
Copper interconnect technology is widely acknowledged as a critical element in achieving NTRSC goals. Copper is also well established in semiconductor packaging. Within wafer fabrication front-end pro cesses, however, copper poses substantial challenges to users, designers, and producers of copper-based process and metrology equipment and materials.
The results of an industry-wide "copper critical" survey conducted in conjunction with Semicon West ྟ will be presented. Important goals included identifying the critical factors in process and metrology tool performance that limit/impact industry's ability to deliver the promised benefits of copper interconnect; and providing data for this "first in a series" of copper-critical programs. The program will be introduced by Ken Monnig of Sematech. The statistical results, selected respondents' comments, survey analysis, and conclusions will be presented by John Hanselman, GM of Philips Analytical/North America. An open Q & A session will follow.
Chair: Ken Monnig, Sema tech
Who should attend: Manufacturing, research and management personnel involved in semiconductor interconnect process development; device design engineers; users and suppliers of copper deposition, etch, CMP, and cleaning materials, and process and metrology tools.
Registration fee: free.
WEDNESDAY
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Practical Negotiation/Influencing Skills for Semiconductor Professionals
Wednesday, Oct. 20, 8:00 am-5:00 pm
Austin Convention Center
Some technical professionals seldom realize how much they negotiate items such as deadlines, budgets, changes, timetables, estimates, resources, disagreements, and performance. Even industry-seasoned buyers and technically savvy sellers may not fully utilize modern, proven tools like bracketing, pivoting, escalation, transparency, the pareto effect, scoring, and trial balloons. Knowing how to negotiate provides a key advantage in problem solving and decision making. Conversely, not knowing represents a serious disadvantage, since unskilled negotiators rarely (if ever) discover how much they needlessly surrender to others.
Who should attend: Semiconductor professionals on all organizational levels - who seek proven methods for maximizing gain whenever value is "in play" or at risk.
Instructors: Robert J. Laser P.E., senior managing partner and Stanley N. Sloan, CMC, managing partner, Alliance Management Consultants
Registration fee: $695, including notes, handouts, exercises, and guides.
Chemical Vapor Deposition
Technology for Integrated Circuits
Wednesday, Oct. 20, 8:30 am-5:30 pm
Austin Convention Center
As the structural complexity of integrated circuits increases, the constraints on deposited layers are becoming more severe, requiring deposition over widely varying conditions. Chemical vapor deposition (CVD) provides the needed flexibility: Single and multiple layers of CVD semiconductors, dielectrics, and metals can be formed over a wide range of deposition conditions. CVD in single-wafer reactors is becoming more widely used, as is integration of related process steps in "cluster tools." Recent trends make it valuable to look at chemical vapor deposition, epitaxial silicon, polysilicon, and CVD metal films in more detail.
Who should attend: This course is designed for technical personnel involved in CVD and others who have recently come into the area from other technical fields.
Instructors: Ted Kamins, department scientist, Hewlett-Packard Laboratories
Registration fee: $695.
Understanding and Using Cost of Ownership
Wednesday, Oct. 20, 9:00 am-5:00 pm
Austin Convention Center
Leading IC manufacturers (including Texas Instruments, Motorola, Intel, Advanced Micro Devices, and IBM ) use cost of ownership (COO) to evaluate equipment purchases. Often required in requests for quotes, COO is growing in importance to an increasing number of equipment manufacturers and material suppliers.
This one-day workshop provides a theoretical foundation and practical understanding of COO concepts and applications. Course instructors demonstrate how to use COO to benchmark equipment or materials and determine the cost impact on the process.
Actual hands-on experience will be provided at computers loaded with the latest generation of Sematech-developed COO software*, where the sensitivity of COO to the various parameters discussed during the course can be measured.
Who should attend: This course is for sales and marketing managers, and design engineers from semiconductor equipment manufacturing; sales and marketing, and applications management from materials suppliers; fab and purchasing management, and equipment and process engineers from device manufacturers. Casual business attire is appropriate.
Instructors: Wright Williams & Kelly
Registration fee: $695, including continental breakfast, lunch, and Cost of Ownership manual. *Software is not included.
THURSDAY
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Semiconductor Processing Technology
Thursday, Oct. 21 - Saturday, Oct. 23
8:00 am-5:00 pm, Austin Convention Center
This seminar covers semiconductor processing technology in detail, in an understandable language. The course instructor presents the basics of the process, including wafer-manufacturing technology, testing and packaging technology, device physics, principles of transistor operation (both bipolar and MOS), factory management, microcontamination, yield, and much more. In-class team assignments enable you to discuss real issues in process design and factory management. This is an introductory course with adequate time for questions. You may ask very specific technical questions about how your products relate to other parts of the wafer fab.
Instructors: Peter Gwozdz, San Jose State University; Richard Blanchard, Failure Analysis Associates
Registration fee: $1395, including Semi Semiconductor Processing Technology workbook, and Modern Semiconductor Fabrication Technology by Peter Gise and Richard Blanchard. Casual business attire is appropriate.
24th International Electronics Manufacturing Technology Symposium
Monday, Oct. 18 - Tuesday, Oct. 19
8:30 am-5:30 pm, Austin Convention Center
Co-sponsored with IEEE, CPMT, and Semi
This year's theme is "Advanced Packaging, Interconnect, and Semiconductor Solutions for the New Millennium." The keynote speaker, Louis A. Martin-Vega, the director of the division of design, manufacture, and industrial innovation at the National Science Foundation (NSF) in Arlington, VA, will speak on "Design and Manufacturing at the National Science Foundation: Past, Present, and Future Perspectives."
As in previous symposiums, registering for IEMT gives you access to the Semicon Southwest trade show. IEMT registration fees: $450; student: $75; includes admission to all IEMT sessions and the exposition, conference proceedings, and lunch on Monday (except one-day registrations).
For more information on Semicon Southwest, contact Semi at ph 650/940-6905 or visit Semi's web site at www.semi.org.
Manufacturing Optimization
8:30 am-12:00 noon
Cost effective manufacturing has become the key to flourishing in a rapidly changing semiconductor industry. This session explores automation and manufacturing optimizations that are vital to low-cost manufacturing.
Chair: Paul Conway, Loughborough University; Erik Jung, FhG-IZM
Advanced Interconnect Technology I
8:30 am-12:00 noon
Advanced interconnect papers have been grouped into three sessions to cover the wide range of evolving new technologies. The papers discuss topics such as solder paste technology, thermosonic bonding, copper plating, and reliability of interconnect structures.
Chairs: Bob Monroe and Craig Beddingfield, Motorola Measurements
Array Packaging II
1:30-5:30 pm
Array packaging encompasses a wide range of technologies that include BGA, CSP, and flip chip. The papers in this field have been grouped into four sessions to help cover the entire spectrum. Topics addressed include 3D packages, analyses of solder joints, fine pitch bumping, high-density substrates, and joint reliability.
Chairs: Jan Vardaman, TechSearch International; Richard Coyle, Lucent Technologies
Semiconductor Technology I
1:30-5:30 pm
Semiconductor technology covers memory, processors and ASIC devices. Papers in this field have been grouped into three sessions and discuss fusing in DRAMs, wafer processing, novel vertical transistor devices, and process optimization.
Chairs: Walt Trybula, Sematech; Kazumi Allen, Shindo
Advanced Interconnect Technology II
1:30-5:30 pm
Advanced interconnect papers have been grouped into three sessions to cover the wide range of evolving new technologies. The papers discuss topics such as solder paste technology, thermosonic bonding, copper plating, and reliability of interconnect structures.
Chairs: Ndy Ekere, Salford University; Lakhi Goenka, Visteon
Array Packaging III
8:30 am-12:00 noon
Array packaging encompasses a wide range of technologies that include BGA, CSP, and flip chip. The papers in this field have been grouped into four sessions to help cover the entire spectrum. Topics addressed include 3D packages, analyses of solder joints, fine pitch bumping, high- density substrates, and joint reliability.
Chairs: Qing Tan, Motorola; Lahki Goenka,Visteon
Semiconductor Technology II
8:30 am-12:00 noon
Semiconductor technology covers memory, processors, and ASIC devices. Papers in this field have been grouped into three sessions and discuss fusing in DRAMs, wafer processing, novel vertical transistor devices and process optimization.
Chairs: Eric Jung, FhG-IZM; Paul Palmer, Loughborough University
Advanced Interconnect Technology III
8:30 am-12:00 noon
Advanced interconnect papers have been grouped into three sessions to cover the wide range of evolving new technologies. The papers discuss topics such as solder paste technology, thermosonic bonding, copper plating, and reliability of interconnect structures.
Chairs: Achyuta Achari, Visteon; Jim Steele, Medtronic
Array Packaging IV
1:30-5:30 pm
Array packaging encompasses a wide range of technologies that include BGA, CSP, and flip chip. The papers have been grouped into four sessions to help cover the entire spectrum. Topics addressed include 3D packages, analyses of solder joints, fine pitch bumping, high-density substrates, and joint reliability.
Chairs: Paul Harvey, 3M; Scott Popelar, IC Interconnect
Semiconductor Technology III
1:30-5:30 pm
Semiconductor technology discusses memory, processors, and ASIC devices. Papers in this field have been grouped into three sessions and cover fusing in DRAMs, wafer processing, novel vertical transistor devices, and process optimization.
Chairs: Paul Thomas Brown and Laura Mendicino, Motorola
System Specific Packaging
1:30-5:30 pm
This session deals with packaging technologies that are unique to various industries. The papers include packaging of displays, optical devices, high-frequency components, and high power devices.
Chairs: Michelle Salagoity, Solectron; Keith Vanderlee, 3M