Impact and behavior of trace contaminants in high-purity plasma process gases
09/01/1999
Abstract
Simply setting an overall gas purity specification may not be sufficient to assure that optimum quality gas is consistently delivered to a process without a more detailed study of the gas supply's impurity fingerprint. This is illustrated for plasma etch processing.
| In this article: |
|---|
| Tracking trace contaminants |
| C4F8 impurity profile survey |
| Impurity variation |
| Chlorinated impurity effects |
| Conclusion |
Charles C. Allgood received his BS in chemistry from Albright College and his PhD in analytical chemistry from the University of Delaware. He has worked as a research chemist at the National Institute of Standards and Technology. Allgood is a technical service chemist with DuPont Fluoroproducts, Chambersworks K-37, Deepwater, NJ 08023; ph 609/540-3170, fax 609/540-3078, e-mail [email protected].