Product News
08/01/1999
Solvent processor
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Evergreen Model 203 solvent processor has applications in metal lift-off, flux removal, resist strip, polymer removal, solvent cleaning, and other solvent processes. Incorporating advanced spin tool wet processing system technology, the 203 combines single-wafer processing with batch immersion solvent processing. Immersion processing - with agitation, heating, chemical recirculation, and multiple chemistry capability - provides for rapid batch processing. Single-wafer spindle processing includes high-pressure and megasonic scrubs for maximum effectiveness. Separation of IPA and DI water in the clean
inse/dry chamber reduces chemistry usage while increasing throughput/ft2. High-speed robotics, with a laser scanner for precise positioning and handling, move wafers through the process, from dry-in to dry-out. A separate handler is dedicated to final, cleaned wafers. Solid State Equipment Corp., Horsham, PA; ph 215/328-0700, fax 215/328-9410.
Overlay metrology system
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The 5300 overlay metrology system provides the accuracy needed to control DUV lithography cells to the <<0.13µµm design-rule level. Designed to handle 200 and 300mm wafers, the high-throughput system maximizes lithography cell productivity with a fully integrated data analysis system that provides immediate, automated stepper and scanner monitoring. A single recipe technique enables the 5300 to measure low-contrast and asymmetric overlay targets consistently and reliably. Features of the system include coherence probe metrology, which uses 3D information for optimal focusing and imaging enhancement for robust overlay measurement. This technology guarantees the correct measurement focus. The 5300 also includes a CMP solutions toolbox, which incorporates this company's coherence probe metrology overlay algorithms for field-proven image formation capability. The toolbox also contains a new brightfield algorithm, for edge enhancement of low-contrast targets, which automatically compensates for large process variations such as overpolish, underpolish, dishing, erosion, or grainy surfaces. KLA-Tencor Corp., San Jose, CA; ph 408/875-6487, e-mail [email protected], www.kla-tencor.com.
Automated tool front-end solution
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The Plus Platform ensures that automation, robotics, information, and isolation technologies are seamlessly integrated into a single, open-architecture platform that meets the requirements of all process and metrology systems in the fab. This is achieved through a series of integrated building blocks that can be custom-configured to the needs of each OEM and fab customer. In addition to offering a new level of connectivity between the process tool and the fab floor, the Plus Platform - which complies with all Semi and I300I standards and guidelines - represents a major step in addressing the chipmakers' desire for a standard front-end interface across the fab. It incorporates multiple loadport (150-300mm), robotic and pre-aligner, auto ID, environmental control, and software systems, fully integrating these critical functions into a turnkey material-handling and fab automation interface for the full range of process and metrology tools. The system is designed to communicate with a supervisory controller and ultimately with the fab's in-house MES system. Asyst Technologies Inc., Fremont, CA; ph 510/661-5000, fax 510/661-5160, e-mail [email protected], www.asyst.com.
Batch implant tool
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Based on the production-proven GSD/HE product platform, the GSD/HEMC high-speed, batch ion implanter offers chipmakers an alternative to slower, less cost-effective serial platforms. It provides the cost-of-ownership and productivity advantages of a high-energy batch system while delivering sufficient beam currents to run at mechanical limit for all low-tilt medium-current applications. The GSD/HEMC was developed to perform well engineering and voltage threshold adjust implants in the volume production of all devices, including logic, DRAM, and flash memory chips. Capable of up to twice the throughput of traditional, serial medium-current systems, the tool features in situ quad capability and fast tune times for highly productive, chained implants. The lower energy range capability is sufficient to allow the system to perform most retrograde well implants. Eaton Semiconductor Equipment Operations, Beverly, MA; ph 978/232-4000, fax 978/232-4275, e-mail [email protected], www.semiconductor.eaton.com.
Packaging/Assembly/Test
Integrated packaging line
The IPL6800-CSP is a fully automated tool that integrates all final processes after testing: lead and mark inspection, laser marking, and taping. Using direct drive rotors and individual CAN-Bus controlled vacuum tools, it gives a minimum throughput of 6500 uph for the latest chip scale packages, as well as for TSOP. Standard configuration is input from JEDEC trays. Tape and reel packaging into two modular tape units allows nonstop final device packaging. M?hlbauer Inc., Newport News, VA; ph 757/873-0424, fax 757/873-0485, e-mail [email protected], www.muehlbauer.de.
Automated bump inspection
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The NSX B-100 is a high-speed, dedicated bump inspection system for the wafer level packaging industry, including flip chips and chip scale packaging. It inspects for all common bump defects, including bump presence, diameter, shape, placement, and defects on bumps. For enhanced process control, the built-in bump metrology and positional automated defect classification feature allows for the highest level of data analysis. The system inspects whole wafers and sawn wafers on film frame, and die in gel/waffle packs, JEDEC trays, MCMs, Auer boats, and other package configurations. August Technology, Edina, MN; ph 612/820-0080, fax 612/820-0060, e-mail [email protected], www.augusttech.com.
CSP/BGA handling
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The DNA-55H handles microBGA and CSP chips with ball pitches down to 0.5mm. Primarily a production machine, it handles both memory and logic packages with an index time of 0.48 sec. Special features include active package alignment prior to insertion into the test socket (using optical pattern recognition or eddy-current sensors) and a force- and stroke-regulated test arm design. This design allows users to custom-control test arm operation to optimize electrical test performance while simultaneously minimizing socket wear and risk of device damage. The DNA-55H also takes advantage of open socket designs to provide true direct contact mode capability. Multiple devices can be tested in parallel with temperature testing from ambient to 125°C, ±3°C. Daito Corp., Yokohama, Japan; ph 81/45-715-3711, fax 81/45-731-1755, e-mail [email protected], www.daito.com.
Gases/Gas Handling
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Gas distribution system
The SGS 6000DE Series features a cost-effective modular manifold and the Gas Safety Monitor-468 controller, both of which are designed for flexible configuration to meet specific applications. The series is available as a manual or an emergency protected system, using air-operated valves. Both provide reliable and efficient solutions for process gas control and monitoring to multiple points-of-use. The GSM-468 gas safety monitor - for distribution of four, six or eight lines - independently operates emergency shutoff valves, monitors excess flow conditions, and displays delivery pressures. Global and remote shutdown, as well as local line shutdown capabilities, are provided. Enclosure shells are designed to sweep air constantly through their interiors to capture potential leaks and direct outlets to the facility exhaust systems. Matheson Tri-Gas, Semi-Gas Div., San Jose, CA; ph 408/971-6500, fax 408/275-8643, www.mathesongas.com.
Process Equipment
High-density plasma etch
The 6540 is a high-density plasma etch tool that is designed for the development and manufacture of nonvolatile FeRAM products. It is configured with an HRe- reactor and dual-frequency RF power and features an easy-open chamber. The tool gives very good mean wafer between clean results. Tegal Corp., Petaluma, CA; ph 707/763-5600, fax 707/765-9311.
RIE/PECVD system
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Available in single- or double-chamber versions and designed for wafers up to 200mm, the BENCHMARK 800-II provides either RIE or PECVD capabilities for process development. RIE processes include SiO2, Si3N4, SiON, and metals; PECVD processes include oxide, nitride, and oxynitride. RIE features include 13.56 MHz power supply with match network, anodized aluminum chamber machined from one piece, water-cooled etch electrode, shower-head gas introduction electrode, MFCs, hoist, chamber lift, and PC control. PECVD features include substrate temperature control to 400°C, in situ variable distance between electrodes, and shower head electrode. Pumping systems include turbo, roots blower/mechanical, and mechanical. AXIC, Santa Clara, CA; ph 408/980-0240, fax 408/980-0524, e-mail [email protected], www.axic.com.
Hardware/Accessories
Edge-welded diaphragm bellows
These edge-welded diaphragm metal bellows are guaranteed for 10 years or 10 million cycles, even in demanding environments. Advanced engineering techniques and life-cycle testing ensure more than 87,600 hours MTBF. Advanced modeling and analysis techniques optimize weight, strength, and component costs of each bellows assembly. Modeling results are compared with results from accelerated life cycle testing of a sample bellows, ensuring that the bellows will meet or exceed specifications under actual operating conditions. Senior Flexonics Metal Bellows Div., Sharon, MA; ph 781/302-1232, fax 781/784-1405, e-mail [email protected].
Feedthrough/actuator
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ChamberLink is a combination feed through and precise harmonic drive servo actuator in one stainless-steel device. It provides high-powered, precisely controlled motion within a vacuum chamber. Because the device has no chamber-wall-penetrating shafts that require seals, vacuum leakage is avoided. ChamberLink seamlessly integrates the harmonic drive with the chamber wall, keeping the motor and input elements on the chamber's ambient side while the geared output shaft moves on the vacuum side. Harmonic Drive Technologies, Peabody, MA; ph 800/921-3332, e-mail [email protected], www.harmonic-drive.com.
Contamination Control
Air-sampling systems
Two multichannel, semiautomatic air-sampling systems, the 2000B and 2100B, allow simultaneous and independent air sampling and monitoring of environmental conditions around the fab at one to four separate locations for a specified time period. Sample probes can be placed up to 100 ft and 40 ft from the instruments. Each sampling chamber is equipped with an advanced optimized air diffuser unit that can recover more than 98% of most gases and vapors inside the absorbent solution. Corrosive inorganic gases and vapors, as well as ppb level trace organic vapors and airborne particulates, can be readily absorbed by the air samplers. System Service Innovation, Sunnyvale, CA; ph 650/326-2768, www.ssi-page.com.
Metrology
Wafer thickness inspection
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WaferGage is a noncontact, laser-based wafer thickness inspection system with 16µm laser beam diameter and the capacity to collect sub-µm measurement data from wafers up to 100mm thick and 150mm in diameter. It is suited to MEMS, read/write head, and optoelectronics inspection, and uses dual DRS laser triangulation sensors. After performing a simple calibration procedure, the operator places a wafer in the holder on the microscope stage and with a mouse-click triggers thickness data collection. Because of the small spot size of the lasers, WaferGage can distinguish even the smallest etchings and features. It collects repeatable measurements regardless of warp or bow up to 2.5mm. After capturing the first thickness measurement, the operator can use the manually adjusted x-y microscope stage to reposition the wafer so that readings can be collected at multiple locations. CyberOptics Corp., Minneapolis, MN; ph 800/746-6315, e-mail [email protected], www.cyberoptics.com.
Vacuum Equipment
Dry vacuum pumps
Brushless DC motors power the AA series dry vacuum pumps, permitting higher rotational speeds and delivering more performance in a smaller physical package. The highly efficient motors reduce energy consumption, lowering operating costs and reducing generation of greenhouse gases. The "smart" controllers start booster pump rotation at atmospheric pressure, cutting pumpdown cycle time, with almost no inrush current. Pumping speeds range from 46 CFM (1300 lpm) to 635 CFM (18,000 lpm). An optional corrosion-resistant main pump provides extended service in chemically aggressive processes such as metal etch. Ebara Technologies Inc., Sacramento, CA; ph 978/465-1983, fax 978/465-5264, www.ebaratech.com.
Dry screw vacuum pump
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The Cobra DS 80 is a small (46 CFM) dry screw vacuum pump with a remote programmable logic controller (PLC) and integrated monitoring system. It eases preventive maintenance and repair of pumps, saving time and freeing additional space in the sub-fab. The user can mount the PLC on top of the pump with a quick-release connector, or on the sub-fab wall. When it is mounted on the wall, the user gains a smaller pump footprint, along with a PLC that resides with the tool. Users can then easily swap out pumps without needing to reprogram, since all the programming is resident in the remote PLC. The new pump automatically synchronizes with this company's other PLCs, and the software in the DS-80 integrates completely with the company's pump monitoring system. This features microprocessor control, an adjustable threshold for warnings and alarms, and a permanent measurement display for exhaust pressure, temperature, motor power, nitrogen, and water flow. Busch Semiconductor Vacuum Group Inc., San Jose, CA; ph 408/955-1900, fax 408/955-0229, www.buschsvg.com.
Vacuum chamber profiling system
This integrated sensor control system provides fully automated monitoring of vacuum chamber environments, providing such advantages as advance warning of a photoresist "hit" and faster P.M. recovery. Cluster Tool Profiler is an in situ multisensor system that interfaces this company's Process Eye software to the cluster tool production system. The software continuously monitors each pumpdown or process and compares what is happening in each vacuum chamber against normal conditions. The system makes use of the cluster tool's SECS II port to effect communications between the cluster tool and its array of chamber-specific sensors. In the event of a deviation from normal operating conditions, alarms are automatically triggered and the operator is given an on-screen diagnosis and instructions. Spectra International, Morgan Hill, CA; ph 408/778-6060, fax 408/776-8575, e-mail [email protected].
Software
Imaging software
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The Zip Slice software module automatically images the entire internal three dimensions of an IC package. It commands a C-SAM acoustic microscope to produce a sequence of nondestructive acoustic slice images, each of which is of a specified internal layer within the IC package. Both the electronic gating of the return echoes and the focus of the ultrasonic beam are optimized for each slice. This is an important feature because the internal resolution of the IC features depends heavily on the resolution of the individual slices. Zip Slice then stacks the individual slices together and shows the entire IC package as a 3D rectangular solid. To see internal features of the IC nondestructively, the stack is soft-ware-sectioned along any plane of the user's choosing. If a 2D plane does not show the desired features, the user may define and remove a 3D cut-out from any part of the stack. Sonoscan Inc., Elk Grove Village, IL; ph 630/766-7088, fax 630/766-4603, e-mail [email protected].
Wafer Cleaning
Advanced single wafer cleaning
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The Capsule Process System, which is integral to the Millennium single-wafer surface preparation platform, is an application module that allows side-selective, multipurpose treatment of wafers. It performs single- or dual-side cleaning and etching within a controlled microenvironment, allowing one side of the wafer to be pro cessed while the other remains un processed. This capability is important for backside cleaning and etching as it affords the ability to select the most effective surface treatment for one side without risk of damage to the other. Alternatively, the Capsule can process both sides of the wafer with like or different media, including rinse and dry of one or both surfaces. This side-selective, multiprocess capability also supports such applications as bevel and edge cleaning to remove films and particles from the exclusion zone of the wafer. The drying process can be either a nitrogen dry or patent-pending, spin-assisted surface tension effect dry, which reduces dry times to <20 sec/wafer while providing a clean, water spot-free surface. Semitool Inc., Kalispell, MT; ph 406/752-2107, fax 406/752-5522, www.semitool.com.
Wafer Handling
Wafer testing chuck
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The TITAN Series ThermoChuck systems, for wafers up to 300mm, provide good structural, electronic, and thermal performance for testing and cycling wafers as low as -65°C and as high as 400°C. They assure rigidity, mechanical stability, electrical shielding, and electrical isolation, fulfilling wafer testing requirements that include femtoamp-level measurements and high pin count probing. Some specifications of TITAN are: surface flatness and surface parallelism, 15µm; surface isolation, 1012/1014 ohms; accuracy, ± 0.5°C; resolution, 0.1°C; growth in "Z," 0.002 in. over -65 to 400°C; deflection, 15µm at 65kg (200mm) and 10µm at 65kg (300mm); and surface capacitance at ambient, <850 pf (8 in.) and <1000 pf (12 in.). Temptronic Corp., Newton, MA; ph 617/969-2501, fax 617/969-2475, www.temptronic.com.
Wafer carrier
The KA250 wafer carrier offers the performance benefits of a PEEK carrier, including low particulates and good mechanical stability and rigidity. Its dimensional stability is superior to that of a PEEK carrier, providing reliable equipment interface and robotic wafer transfer. Stable Wafer pocket design technology allows more repeatable robotic access. The wafer plane is controlled, and even with the wafer removed from its pocket up to 2.5 in. from the fully seated position, there is no wafer chatter or flutter. The KA250 exceeds Semi's CD tolerances, allowing highly accurate equipment interface. Fluoroware Inc., Chaska, MN; ph 612/448-8193, fax 612/368-4078.