Product News
05/01/1999
DUV step-and-scan system
 |
Micrascan 193 is a production-worthy 193-nm step-and-scan lithography system that is specified at 130nm for grouped features, with a 0.6µm depth of focus. It achieves system overlay performance of 45nm and has a large field size. The 193 addresses the challenges of the 150nm node and beyond with conventional binary reticles, allowing greater depth of focus and process latitude than current higher 248 NA systems. Silicon Valley Group Inc., San Jose, CA; ph 408/467-5949, fax 408/467-5867, e-mail [email protected], www.svg.com.
CV, IV thermal measurements
With the trend toward SiGe technology for wireless ICs, and the move toward copper, low-k, and shrinking geometries (0.18 and 0.13?m) for CMOS, there is an increasing need for highly accurate CV-IV probing on 200mm wafers. The 12860 probe station provides ultralow CV-IV probing expressly designed for 200mm. It incorporates AttoGuard technology, delivering an ultralow capacitance variation of <3fF and featuring an ultralow 1pF thermal chuck with a very fast settling time (<50fA in 50 milliseconds with a 100V step). The chuck leakage and noise is <20fA over the full temperature range -65 to 300?C. Cascade Microtech Inc., Beaverton, OR; ph 503/601-1672, e-mail sales@
cmicro.com, www.cascademicrotech.
com.
RDRAM production test system
 |
The RDX2200 is a 1Gb/sec, full-function production test system with the flexibility to address evolving RDRAM test methodologies. Its Sequencer Per Function timing architecture and proprietary liquid cooling technology reduce pattern dependent error significantly. This assures ±50ps edge placement accuracy - pattern to pattern, DUT site to site, and tester to tester - and features such as digital and hierarchical calibration methodology to the DUT reduce error throughout the entire timing path. Critical component junction temperatures throughout the mainframe and test head are controlled to deliver stable and repeatable measurements for high-volume manufacturing. Production readiness is confirmed with TruEdge, a comprehensive suite of calibration and validation software tools. The RDX2200 features the rPacket Generator, which simplifies programming and provides RDRAM interface and Direct Access mode testing on a single platform. Complete handler interface hardware allows easy test head docking and manipulation. A common system platform, used for all this company's RDRAM test systems, allows a cost-effective, seamless transition from design validation to device characterization and production. Schlumberger ATE, San Jose, CA; ph 408/453-0123, fax 408/437-1976, e-mail memorysys@
san-jose.tt.slb.com, www.slb.com/ate/RDRAM.
Dry scroll primary vacuum pumps
The TriScroll 300 and 600 dry scroll primary vacuum pumps are suitable for such applications as incorporation into analytical instruments, load locks, PVD systems, primary pumping for turbo- and ion-pumped systems, cryogenic pump roughing, and other uses that demand a clean hydrocarbon-free environment. They incorporate a dual-scroll, two-stage pump with the scroll sets operating in series to provide high compression for light gases. The devices are immune to the effects of water vapor, which can cause maintenance problems in scroll pumps. Other features of these oil-free pumps are a high pumping speed of 250
and 500 liters/min (peak); low ultimate pressure of <10-2 torr; and a very durable mechanical construction, including a benign tip seal, automatic gas ballast, bearing purge point, and improved bearing seals. Varian
Vacuum Products, Lexington, MA; ph 800/882-7426 or 650/424-5781, e-mail [email protected], www.varian.com.
Copper and tantalum targets
Prelude diffusion bonded copper and tantalum targets are now available for Applied Materials' Electra system. This design metallurgically joins the high-purity target material to a high-strength aluminum alloy backing plate. Prelude copper targets are made from high-purity, vacuum-melted and cast copper, featuring low gas content; they have a controlled fine grain size <20 µm and are available in 4N, 5N, 6N and 7N purity. Prelude tantalum targets feature electron-beam refined tantalum in purities of 3N5, 4N and 4N5. The diffusion bonded tantalum assembly has a fine grain size
<70 µm. Tosoh SMD, Grove City, OH; ph 614/875-7912, fax 614/875-0031, e-mail [email protected], www.tsmd.com.
ITO coating solution
Developed for low-temperature fabrication of transparent conductive coatings, this new ITO coating solution can be deposited on the substrate by spinning or dipping, and cured at relatively low temperature (~200°C). The resulting coating is transparent and has a sheet resistance between 103 and 104 W. The solution is stable and easy to use; it is well-suited to preparation of transparent conductive coatings, and transparent electrodes and anti-static films. Chemat Technology Inc., Northridge, CA; ph 800/475-3628, fax 818/727-9477.
Vacuum pumps
 |
On-Board TurboPlus vacuum pumps offer the process advantages of throughput pumping and the uptime benefits of high-speed water pumping, integrated into a compact package with a single interface. The integrated pumping stack is optimized to reduce footprint and maximize flexibility. The TurboPlus microprocessor communicates directly with both the turbo pump controller and the water pump, coordinating operation. Preprogrammed routines, tailored by the user, provide safe, automatic startup, shutdown, regeneration, and power failure recovery. Control options include local or remote keypad, RS-232, or easy integration into the On-Board vacuum network. CTI-Cryogenics, Mansfield, MA; ph 508/337-5112, fax 508/337-5180.
Helium leak detection
The ASM 122D is a portable dry leak detector - with remote control - offering compact dimensions and high performance. Helium pumping speed is 4 l/sec, and sensitivity is 5 X 10-12 mbar l/sec. The 122D is ideal for areas such as sub-fabs, where space is very limited. Alcatel Vacuum Technology, Annecy, France; ph 33/0450-657777, fax 33/0450-7789, e-mail [email protected].
Ultrasonic flowmeter
 |
The UPT868 Ultra-Pure Flow is a measurement system that gives straight-through flow while maintaining 100% sealed integrity for high-purity liquids such as DI water and weak chemical solutions. Contaminants cannot enter the system, so the liquid's original purity level is maintained. UPT868 consists of a clamp-on flow tube unit and a display. The flow tube unit is a PVC block with an ultrasonic transducer fixed at each end. Running through the PVC block is a straight run of 15 in. of PFA tubing that carries the fluid. Tubing sizes range in diameter from 3/8 to 3/4 in. In use, the flow tube unit is spliced into the flow system and becomes an integral part of the system. The two transducers send and receive signals to/from each other using the flow tube as a waveguide. The signals are processed by the UPT868 transmitter, which also displays the flow rate. Panametrics Inc., Waltham, MA; ph 800/
833-9438, fax 781/894-8582, e-mail [email protected], www.panametrics.com.
Wafer temperature monitor
 |
The NTM500 is a noncontact, emissivity-independent wafer temperature monitoring system that is used in situ during processing. It is suitable for such processes as RTP, PVD, and HDP-CVD and incorporates real-time, same-point, active-emissivity measurement and compensation. This feature, as an addition to standard pyrometry, allows accurate extraction of the temperature for all product wafers, regardless of thin film structure (emissivity). The system is available in three temperature ranges: 200-600, 250-700, and 400-1250?C. Update rate is up to 30 Hz. CI Systems Inc., Westlake Village, CA; ph 650/566-0444, fax 650/566-9784, e-mail [email protected], www.ci-systems.com.
Megasonic cleaner
The Goldfinger megasonic module processes individual wafers horizontally. Wafers are lowered into a process chamber, where they are treated with a combination of chemistry and megasonic energy. The megasonic transducer covers just over half of the radius of the wafer, providing uniform energy coverage to prevent redistribution and reattachment of particles. The acoustic energy is transferred to the wafer through the liquid interface at the surface of the wafer. Liquid is also sprayed on the back of the wafer to continue the energy transmission, providing effective backside cleaning. Verteq, Santa Ana, CA; ph 714/445-2000, fax 714/445-2204, e-mail [email protected].
Megasonic cleaner
The Goldfinger megasonic module processes individual wafers horizontally. Wafers are lowered into a process chamber, where they are treated with a combination of chemistry and megasonic energy. The megasonic transducer covers just over half of the radius of the wafer, providing uniform energy coverage to prevent redistribution and reattachment of particles. The acoustic energy is transferred to the wafer through the liquid interface at the surface of the wafer. Liquid is also sprayed on the back of the wafer to continue the energy transmission, providing effective backside cleaning. Verteq, Santa Ana, CA; ph 714/445-2000, fax 714/445-2204, e-mail [email protected].
Ceramic spacer for diffusion furnaces
This ceramic spacer is intended for use in a new range of heating elements. Its design totally encloses each element coil and dovetails to the next spacer, ensuring that the whole winding is securely held. The spacers are also secured into the surrounding fiber insulation, helping to keep sagging of the element coil to a minimum. They can be supplied for any make or type of diffusion furnace. Hitech Furnaces Ltd., Sutton Coldfield, UK; ph 44/121-352-1404, fax 44/121-353-4311, e-mail HTFurnaces@
aol.com.
Gas detection and monitoring
 |
Six new gas-detection calibrations, for the MDA Scientific Model CM4 continuous gas monitor, allow the instrument to detect and continuously monitor dry arsine, low level hydrogen chloride, low level hydrogen bromide, hydrogen selenide, nitrogen dioxide, and hydrogen iodide. Model CM4 can detect and monitor more than 40 toxic and corrosive gases, including amines, hydrazines, hydrides, and mineral acids. It uses the Chemcassette colorimetric detection system, which provides physical evidence of a gas release, and its output options include LonWorks capability, allowing peer-to-peer communication over a network. This new option complements existing output options, including 4-20 mA analog, RS-232, and RS285 serial communications. Zellweger Analytics Inc., Lincolnshire, IL; ph 847/634-2800, fax 847/634-1371, www.zelana.com.
Sub-atmospheric gas delivery
This system is designed for use with HDP-CVD systems in production manufacturing. The sub-atmospheric phosphine source allows rapid integration of HPD-CVD phosphosilicate glass, which is finding increasing use as a pre-metal dielectric for sub-0.25µm device geometries. The system provides large volumes of phosphine gas with enhanced safety over compressed gas alternatives. Using materials that bind specific gas molecules, the system effectively converts "high-pressure" toxic gases to "no pressure" materials, allowing safer and higher-volume storage. ATMI Inc./NovaSource, Danbury, CT; ph 203/794-1100, e-mail [email protected], www.atmi.com.
Ion implantation enhancement
Enriched silicon-29 tetrafluoride is an isotopically engineered gas that can greatly increase ion implantation productivity. Natural silicon consists of three stable isotopes of differing atomic masses - silicon-28, -29, and -30. Silicon-29 is the most desirable of these for implantation since its mass is not the same as other chemical species (e.g., nitrogen or carbon monoxide) that may be implanted inadvertently with silicon. By enriching the silicon-29 to levels above the natural abundance, the productivity of an ion-implantation tool can be improved proportionately to the increased concentration; e.g., silicon tetrafluoride enriched to 10% silicon-29, rather than the natural 5%, would increase the beam current by 500%. Isonics Corp./Voltaix Inc., San Jose, CA; ph 408/350-0660, fax 408/350-0659, www.isonics.com.
SPM for polymer research
The Explorer PolymerSystem is a scanning probe microscope (SPM) designed for polymer industrial and research laboratories. It combines the inherent resolution of SPM with the power of Micro Thermal Analysis (µTA) and Pulsed Force Mode (PFM) imaging to create a single system that is capable of imaging and analyzing a material's physical, mechanical, and thermal properties with submicron spatial resolution. Micro Thermal Analysis can measure and map thermal conductivity, thermal diffusivity, plane transition temperatures, and thermal expansion rates for sample volumes <1µm in diameter. Pulsed Force Mode imaging, an intermittent contact imaging mode, can simultaneously acquire separate topography, stiffness, and adhesion images, allowing independent evaluation of topographic, mechanical, and chemical properties, all from a single rapid scan. Thermo Microscopes, Sunnyvale, CA; ph 408/
744-3052, e-mail [email protected], www.thermomicro.com.
Etch/sputter coating for SEM samples
The Precision Etching and Coating System (PECS) is an ion beam-based system designed to etch and/or sputter coat scanning electron microscope (SEM) samples. The compact, benchtop instrument employs single-function, manual controls, providing ease of operation, reducing sample handling, and decreasing contamination. It is particularly suitable for preparation of semiconductor cross-sections and can reliably delininate and expose the microstructure of a variety of layers/areas in IC devices. The addition of a reactive ion beam etching attachment to the PECS improves etching/cleaning capabilities by comparison with argon etching, not only increasing etching rates but further enhancing image contrast in semiconductor devices. Gatan Inc., Pleasanton, CA; ph 925/463-0200, e-mail [email protected], www.gatan.com.
Thin-film measurement
The F40 thin-film measurement system uses spectral analysis of reflections from the top and bottom of the thin film to provide thickness measurements in a few seconds. For measurements on patterned surfaces and other applications that require a spot size as small as 10µm, the F40 can be added to a microscope - for common microscopes, it is a simple bolt-on attachment, complete with c-mount for CCD cameras. Almost any smooth, translucent or lightly absorbing film can be measured, including SiO2, photoresist, polysilicon, SiNx, polyimide, amorphous silicon, polymer layers, and DLC. Filmetrics Inc., San Diego, CA; ph 619/554-0005, fax 619/554-1311, e-mail [email protected], www.filmetrics.com.
Wafer identification
WALLY is a completely integrated bulk wafer aligner and wafer identification tool that is designed to occupy a tabletop footprint <8 X 16 in. It reads the serial number of the first wafer in the cassette, regardless of the physical location of the wafer in the cassette. A GEM-compliant SECS-II interface facilitates quick implementation into most MES architectures. Other features include optional cross-slot detection and wafer counting for improved inventory control visibility. The 150mm model is currently available, and 200 and 300mm platforms will be released imminently. Vision Boxes Inc., Alpharetta, GA; ph 770/772-9890, fax 770/772-6045.
CSP and BGA singulation systems
These high-throughput, multiwheel systems for chip scale packaging (CSP) and ball grid array (BGA) singulation are cost-effective production formats for sawing, and alternatives for routing, punching, and typical trim and form operations. For fully encapsulated CSP strips of 75 X 250mm, throughput is >10,000 UPH on a 7 X 7 package. The multiwheel approach accommodates various part sizes, including rectangles. The systems include Windows NT-based, open architecture controls and a state-of-the-art vision system. From large BGA panels to CSP strips, fully automated turnkey production solutions are available with tape mounting or tapeless pick-and-place. Manufacturing Technology Inc., Ventura, CA; ph 805/644-9681, fax 805/
644-3541, e-mail [email protected].
Submicron semiconductor probing
These two systems put an end to device under test (DUT) damage and heavy loading of circuits, and can be used for flip chip probing. The MFI Real-Time Prober is designed to probe packaged parts and wafers. Tip and laser alignment is automated, the system has expansion capability to support four probe heads simultaneously, and it supports passive RF, active RF, and DC probe tips. The AFM Sampling Prober is suitable for both front and backside probing, and because it can couple through dielectrics, preparation of the DUT is often unnecessary. The MFI probe tip can operate in FIB trenches as small as 2µm2 and 5µm deep. Micron Force Instruments Inc., San Jose, CA; ph 408/501-0790, fax 408/501-0794, e-mail [email protected].
CO2 fire-suppression system
These high-pressure CO2 fire-suppression systems are custom-designed for wet bench fire protection in cleanrooms. They require minimal maintenance. CO2, a readily available and noncontaminating agent, rapidly extinguishes fire and is scavenged into the cleanroom exhaust system, minimizing
the time needed for clean-up. Unlike
water, CO2 does not conduct electricity. J&S Technical Assoc., Florham Park, NJ;
ph 973/443-0516, fax 973/443-0528.