Product News
04/01/1999
Fluorine laser series
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The LPF Fluorine laser series, the "Photonic Hammer," has high quantum energy of almost 8 eV carried by 157-nm photons. With pulse energies up to 25 mJ, repetition rates up to 300 Hz, and output power >5 W, the LPF series is suitable for micromachining tough materials (quartz/fused silica, Teflon/PTFE, and glass); for developing next-generation optics, resists, and scanners for DUV lithography at 157 nm; for micro-optic fabrication and testing; and for surface analysis. This company's innovative metal/ceramic NovaTube and Magnetic Switch Control technologies give the LPF very good performance in gas lifetime, pulse energy, and power. Lambda Physik Inc., Fort Lauderdale, FL;
ph 954/486-1500, fax 954/486-1501, e-mail [email protected], www.lambdaphysik.com.
Plasma etch tool
This new technology selectively etches both sides of wafers (up to 200 mm) without using hazardous chemicals. The Aspen LiteEtch TSE etches transistor isolation layers on advanced DRAM, SRAM, flash, microprocessor, and logic devices. It is intended mainly for selective removal of nitride over oxide after shallow trench isolation. Silicon nitride has traditionally been removed using a hazardous, 160-180°C hot-phosphoric acid process in a wet bench, posing environmental problems and safety concerns. The new tool uses this company's field-proven inductively coupled plasma source to generate the fluorine-based dry process chemistries that are necessary to etch films with good repeatability. A unique chamber design ensures that films on both sides of the wafer are etched simultaneously, two wafers at a time in a single-chambered system, and as many as four at a time in a dual-chambered system. The system includes such features as a monochromator and a neural network-based endpoint detector for closed-loop control. Mattson
Technology Inc., Fremont, CA; ph 510/657-5900, fax 510/657-0165, www.
mattson.com.
CD SEM
The IVS 230 critical dimension scanning electron microscope enhances control over steppers, etchers, and other process tools that directly affect yield. It provides measurement repeatability to 3 nm (3s) and unattended throughput of >35 wafers/hour with >99% automation and measurement success. Digital scan control ensures stable magnification calibration while measurement algorithms provide robust edge detection. Automation effectiveness is maximized through use of advanced pattern recognition, which allows measurement of device features in-circuit. Schlumberger ATE, San Jose, CA ; ph 408/453-0123, fax 408/437-1976, e-mail verificationsys@
san-jose.tt.slb.com, www.slb.com/ate.
Laser cutting system
QuikLaze II is a compact, pulsed, single- or multiwavelength Nd:YAG laser cutting system designed for microelectronics machining. This second-generation system features an enhanced repetition rate (from 20 to 40 Hz), the addition of a fourth harmonic (266 nm), and inclusion of a video spot marker. Models are available with user-selectable wavelengths of 1064, 532 and 355 nm, or 532 and 266 nm. The system is suitable for trimming high-frequency gold capacitors and small batches of thick- and thin-film resistors; for cutting ITO shorts on LCD panels; and for removal of polyimide, silicon nitride, passivation, aluminum, and gold and copper metal lines from semiconductor devices. The system makes uniform, repeatable, single-shot cuts from 50 ? 50-?m (50? objective) to 1 ? 1-?m (100? objective). New Wave Research, Sunnyvale, CA; ph 408/328-0220, fax 408/328-0234, e-mail [email protected], www.new-wave.com.
uTAB and uBGA lead bonder
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The 8020 uTAB automatic lead bonder offers bonding speeds >15 leads/sec. It was developed for single-point bonding of CSPs, including the Tessera-licensed uBGA, a package that is targeted at the Rambus Direct RDRAM high-speed memory module. The new tool bonds leads directly to bond pads one lead at a time in an S shape, allowing the package to compensate for thermal variations between the die and the PC board. Bond placement repeatability is ?5 um @ 3o. Based on the 8020 ball bonding platform, the bonder's features include open software architecture and multiple material-handling options for factory integration flexibility, and a fully programmable material-handling system with conversion times <5 min between different leadframe types. Kulicke & Soffa Industries Inc., Willow Grove, PA; ph 215/784-6000, fax 215/659-7588, www.kns.com.
Vision for flip chip and BGA rework
The Summit 1100HR rework system has high-resolution vision featuring optics capable of 40? magnification, providing enhanced imaging for rework of flip chips and uBGAs, as well as fine pitch leaded devices. The system achieves very good positional accuracy with a um-adjustable
X-Y table and a precision drive system. It also features special nozzles for smaller components and high-density assemblies. Sierra Research and Technologies Inc., Westford, MA; ph 978/392-0633, fax 978/392-0638.
Residual gas analysis system
MASsoft SPC, a statistical process control RGA system, provides fully automated vacuum process monitoring with QA quality SPC chart outputs suited to the latest quality audit procedures, including ISO 9001. It requires zero RGA spectroscopy interpretation, with operator intervention limited to selection of a prescribed process run recipe. The system interfaces to the process tool, automatically acquiring data for each critical process step, and it includes the flexibility to accommodate delays and changes to the process step routine, ensuring highest quality data even when the process is halted or paused during a run. Hiden Analytical Ltd., Warrington, UK; ph 44/1925-445225, fax 44/1925-416518, e-mail [email protected], www.hiden.co.uk.
Saturated air delivery
This gas humidifier aids the efficiency of delivery of saturated air in semiconductor manufacturing. The process wets the gas (wet oxidation) prior to its entry into the furnace environment, instead of actually mixing with the gas in the furnace. The device is designed to maintain a fixed level of deionized water through which the gas is bubbled. The water is temperature-controlled at just below boiling to produce maximum saturation without producing steam. The control system mounts onto the cabinet and is designed to maintain the liquid level and regulate liquid temperature. Temperature is controlled by a PID algorithm to ensure minimal overshoot and stabilized control. Cal-Glass for Research Inc., Costa Mesa, CA; ph 714/546-7250, e-mail [email protected], www.cal-glass.com.
Bulk gas regulator
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The 15 Series ultrahigh-purity bulk gas regulator features a flow capacity of Cv = 8.0, 316L stainless steel barstock construction, 10 Ra-uin. internal finishes, and a rated flow of 400 scfm. Designed expressly for semiconductor manufacturing, it offers a full internal electropolish and minimal entrapment areas for efficient purging. There are reduced threads in the wetted areas and a design maximum leak rate of 1 X 10-6 atm cc/sec He at the valve seat. Spring adjust, wrench adjust, or air actuation are available, with a choice of port sizes up to 2 in. Inlet pressure rating is 300 psig, while the outlet pressure range is 0-130 psig. The 15 Series is compatible with the ER3000 electronic controller to provide a closed-loop pressure control system. Tescom Corp., Elk River, MN; ph 877/483-7266, fax 612/241-3224.
Ultrahigh-purity pressure transducer
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Model 214 is an ultrahigh-purity, capacitive flow-through pressure transducer that uses VIM/VAR 316L SS electropolished to 7 Ra: 10 max. finish. It is available with a standard 1/4, 3/8, or 1/2-in. diameter tube, with optional face seals or tri-clover sanitary fittings. The 214 is bakable to 125°C without affecting calibration and is mass spectrometer helium-leak tested to 1 X 10-10 ATM.CC/sec. Based on proven capacitive sensing technology, it is virtually EMI/RFI immune. Available with a full scale output of 4-20 mA and 0.2-5.2 VDC, the 214 comes with a 6 ft (1.8 m) multiconductor bendix cable or 15 pin SUB-D connector. It offers ±0.25% FS accuracy and measures pressure ranges from 0-50 to 0-3000 psig, as well as -14.7-50 to -14.7-3000 psig. Setra Systems Inc., Boxborough, MA;
ph 800/257-3872, e-mail sales@setra.
com, www.setra.com.
Excimer laser
The EX10 excimer laser produces moderate pulse energies at high repetition rates in a compact, air-cooled package. Output energy varies from 10 to 30 mJ, depending on the excimer wavelength. The laser is available in 250- and 500-Hz models and gives up to 10 W at 248 nm and 5 W at 193 nm. It uses a total metal/ceramic design and can operate on XeCl for up to six months without gas exchange. Gas refill is accomplished using the on-board vacuum pump from a Windows-based software package that controls all laser functions. Pointing stability is better than 10uRadians/C. GAM LASER Inc., Orlando, FL; ph 407/851-8999, fax 407/850-0700, www.gamlaser.com.
Fan filter unit
FANTOM is a high-performance, fan-powered, laminar flow, HEPA filter module that provides Class 100 air over a nominal 2 ? 4 ft area with a very low height profile. Extremely quiet in operation, FANTOM has proven 49 dBA performance. Clestra Cleanroom Inc., N. Syracuse, NY; ph 800/253-7872, fax 315/452-5204, www.clestra.com.
CMP waste treatment system
WIS (waste interface system) is a self-contained, PLC-controlled system that is placed behind or below a CMP polisher. A light scattered sensor monitors solids content in real time. Based on these readings, clear effluent is separated from the waste, and clear water is diverted back to the polisher. Approximately 50% of the WIS output can be diverted for other uses, and a substantially reduced concentrated waste stream is pumped to the drain for further treatment or reclamation. Lucid Treatment Systems, Hollister, CA; ph 831/634-4800, fax 831/634-4805, e-mail [email protected], www.lucidtreatmentsystems.com.
Detection of contaminants in DUV
IonPro-IMS is designed for the sub-ppb to ppm detection of airborne contaminants such as total amines, total acids, ammonia, and n-methyl pyrrolidone. For use in DUV lithography, IonPro-IMS improves resist uniformity, maximizes filter life, and reduces process downtime. It incorporates ion mobility spectrometry (IMS) technology with an internal four-channel multipoint sampling system for easy monitoring in and around a DUV track and stepper. Molecular Analytics, Sparks, MD; ph 800/635-4598 or 410/472-2146, fax 410/472-2156, e-mail [email protected].
Chemical blending and delivery
The iBIS 7500 compact blend-delivery system meets the requirements of post-CMP cleaning, specifically copper processes and slurries containing alumina. It provides a constant pressure supply of dilute chemical through the distribution piping system without the use of a day tank. The "On-Demand" blend system supplies dilute chemical, as required, to make up for consumption by the process tools. Total output capacity is up to 19 liters/min, depending on the dilution ratio. Additional features include a dispense filter, sample port, PLC controller to log trend data, electronic chart recorder, and pump and filter bypass mode for on-line servicing. BOC Edwards, Wilmington, MA; ph 800/848-9800, www.bocedwards.com.
Ultrapure pump
Machined Teflon PTFE wetted materials, engineered plastic composite fasteners, an integral piston diaphragm, and new sealing techniques enable the P.050 Ultra-Pure pump to transfer corrosive liquids with low contamination and high purity. The Pro-Flo air distribution system is the driving force behind reliable, 24-hour recirculation in demanding semiconductor processes. The pump is designed to withstand high-temperature duty cycling up to 120?C (250?F). Wilden Pump & Engineering Co., Grand Terrace, CA; ph 909/422-1730, fax 909/783-3440, www.wildenpump.com.
CD-SEM for sub-0.15 um
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VeraSEM is a system for the automated measurement and imaging of sub-0.15-um device features. Its process variation monitoring (PVM) technology speeds users' process development time and ensures better process control. Based on a new, extendible platform, the system is designed to handle both 200- and 300-mm wafer sizes and can be upgraded to measure sub-0.13-um geometries. Using a unique column design and new algorithms, PVM technology allows increasingly vital measurements to be made on the device, including line edge roughness, line edge width variation, and the distinguishing of open/closed contact holes. Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, www.appliedmaterials.com.
Transporting and aligning FPDs
Designed for the ultraprecise transport of large, high-resolution flat panel displays (FPDs), the Gencobot 8Y (GB8Y) robot employs the Global Positioning Robot (GPR) system, which allows six-degrees-of-freedom, servo-controlled movement that can compliantly interact with misaligned cassettes and process modules, as well as deliver deflection compensation during transport. GB8Y accommodates panels weighing up to 10 kg and measuring 1 m2. Using a yaw-axis feature, it eliminates the need for radial placement of process stations/cassettes around the robot and facilitates on-the-fly panel realignment when combined with this company's noncontact FPD prealigner. The GB8Y comes standard with an 8-16-8-in., 3-link arm and vertical stroke options of 12.5, 17, 20, and 25 in. Genmark Automation, Sunnyvale, CA; ph 408/745-6520, fax 408/745-0635, www.genmarkautomation.com.
Semiconductor equipment interface
SmartLink 1100, an intelligent equipment interface for semiconductor manufacturing lines, measures 9 X 7 X 4 in. and interfaces between two in-line machines using SMEMA inputs and outputs. It monitors and converts communications between machines and can customize SMEMA protocol as needed. This flexibible communication capability allows SmartLink to provide complete SMEMA compatibility to noncompatible equipment. An optional sensor and stop pin can be used to add SMEMA capability to equipment without SMEMA. By monitoring line communications, the system can provide statistical process information such as cycle time, work piece count, and production rate. Data can be logged, and a report is available on an LCD display. An alarm and optional beacon can be used to alert the user when an event occurs outside preset control bands. Allegrotek, Carlsbad, CA; ph 760/603-0260, fax 760/603-0261, e-mail [email protected], www.
allegrotek.com.
Yield enhancement software
LogicMap is a software solution that allows automatic overlay of logic device failure information at the signal level with wafer fabrication information. It enables fab engineers to translate automatically a logic device's binsort functional test data into XY coordinates for yield and failure analysis, reducing translation time from weeks to hours. Electroglas Inc., Santa Clara, CA; ph 408/727-6500 ext 6511, e-mail [email protected].
Probe mark inspection
The PMI 2000 is a machine vision-based, high-speed, on-line probe mark inspection system that detects the presence/absence of marks; their locations and areas; the number of probe marks; passivation damage; split, worn and light probes; and prober drift. This allows the automatic re-probe of continuity failures, seamless integration with existing auto probers, and the archiving of defect images. Data on each probe mark is networkable to the fab database. IDentek Corp., Irvine, CA; ph 949/752-1917, fax 949/752-1546, e-mail [email protected], www.identek.com.
Electronic level wafers
The electronic level wafer is a precision level built into the form factor of a silicon wafer, making possible the precise leveling of robots, platforms, and vertical quartz boats. Remote display allows a technician to make adjustments to the level, and see and hear the adjustment effect in real time. MicroTool, Colorado Springs, CO; ph 719/471-9888, fax 719/471-9977, e-mail [email protected], www.microtool.net.
DUV step-and-scan system
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Micrascan 193 is a production-worthy 193-nm step-and-scan lithography system that is specified at 130 nm for grouped features, with a 0.6-um depth of focus. It achieves system overlay performance of 45 nm and
has a large field size. The 193 addresses the challenges of the 150-nm node and beyond with conventional binary reticles, allowing greater depth of focus and process latitude than current higher 248 NA systems. Silicon Valley Group Inc., San Jose, CA; ph 408/467-5949, fax 408/467-5867, e-mail [email protected], www.svg.com.
Copper and tantalum targets
Prelude diffusion bonded copper and tantalum targets are now available for Applied Materials' Electra system. This design metallurgically joins the high-purity target material to a high-strength aluminum alloy backing plate. Prelude copper targets are made from high-purity, vacuum-melted and cast copper, featuring low gas content; they have a controlled fine grain size <20 um and are available in 4N, 5N, 6N and 7N purity. Prelude tantalum targets feature electron-beam refined tantalum in purities of 3N5, 4N and 4N5. The diffusion bonded tantalum assembly has a fine grain size <70 ?m. Tosoh SMD, Grove City, OH; ph 614/875-7912, fax 614/875-0031, e-mail [email protected], www.tsmd.com.