Flip chip bonder

03/01/1999

Flip chip bonder

Model 860 Omni is designed for use in low-volume flip chip production run applications involving gold, solder, adhesive, or stud bumps. Its features include tabletop configuration to conserve floorspace; internal PC for control of bond load, temperature profiles, process times, and machine cycles in order to minimize operator involvement; mimimum and simpified screen display menus; and a strategically placed joystick. The 860 Omni aligns and attaches die sizes from 0.006 to 1 in.2 at a throughput of 200 placements/hour with placement accuracy of ?5 ?m. Die presentation can be made from 4 or 2 in.2 waffle or gel packs, and custom die trays can also be accommodated. Four closed loop bond load control ranges are available, from 5 to 10 kg. Precision servo motor-driven Z motion and closed loop temperature control are standard features. The tool is equipped with an extend-retract cube beam splitter viewing system and/or swing in-out direct viewing stereo zoom microscope with 10? eyepiece and fiber optic illuminator. Semiconductor Equipment Corp., Moorpark, CA; ph 805/529-2293, fax 805/529-2193, www.semicorp.com.